Investigation on microstructure transformation and failure behavior of Cu-Cd-Nb-CP electrical contact material

Y. S. Cui; W. Z. Shao; L. Zhen; V. V. Ivanov

doi:10.4028/0-87849-960-1.869

Investigation on microstructure transformation and failure behavior of Cu-Cd-Nb-C_P electrical contact material

Y. S. Cui^*
, W. Z. Shao
, L. Zhen
, V. V. Ivanov

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology
Siberian Federal University

Research output: Contribution to journal › Conference article › peer-review

Abstract

Dependence of microstructure upon transfer stability of the powder-metallurgy copper-diamond electrical contact material with Cr and Nb addition during type-test process is investigated by optical microscope and SEM observation. During making and breaking process, micro-cracks occurred along grain boundaries under electrical and mechanical forces. Addition of cadmium into the composite increases oxidizable capability of this material, and also leads to oxide accumulation along grain boundaries. These factors reduce the reliability of electrical contacts in practice. Arc erosion quantities during commutation operation processes relates with grain size of matrix and particle size of the second metallic phase. The optimal grain size is 20-50μm and 10-20 μm for niobium particles in these tests.

Original language	English
Pages (from-to)	869-872
Number of pages	4
Journal	Materials Science Forum
Volume	475-479
Issue number	II
DOIs	https://doi.org/10.4028/0-87849-960-1.869
State	Published - 2005
Event	PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing - Beijing, China Duration: 2 Nov 2004 → 5 Nov 2004

Keywords

Copper-based composite
Electrical contact material
Microstructure
Performance

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10.4028/0-87849-960-1.869

Cite this

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title = "Investigation on microstructure transformation and failure behavior of Cu-Cd-Nb-CP electrical contact material",

abstract = "Dependence of microstructure upon transfer stability of the powder-metallurgy copper-diamond electrical contact material with Cr and Nb addition during type-test process is investigated by optical microscope and SEM observation. During making and breaking process, micro-cracks occurred along grain boundaries under electrical and mechanical forces. Addition of cadmium into the composite increases oxidizable capability of this material, and also leads to oxide accumulation along grain boundaries. These factors reduce the reliability of electrical contacts in practice. Arc erosion quantities during commutation operation processes relates with grain size of matrix and particle size of the second metallic phase. The optimal grain size is 20-50μm and 10-20 μm for niobium particles in these tests.",

keywords = "Copper-based composite, Electrical contact material, Microstructure, Performance",

author = "Cui, \{Y. S.\} and Shao, \{W. Z.\} and L. Zhen and Ivanov, \{V. V.\}",

year = "2005",

doi = "10.4028/0-87849-960-1.869",

language = "英语",

volume = "475-479",

pages = "869--872",

journal = "Materials Science Forum",

issn = "0255-5476",

publisher = "Trans Tech Publications Ltd",

number = "II",

note = "PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing ; Conference date: 02-11-2004 Through 05-11-2004",

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TY - JOUR

T1 - Investigation on microstructure transformation and failure behavior of Cu-Cd-Nb-CP electrical contact material

AU - Cui, Y. S.

AU - Shao, W. Z.

AU - Zhen, L.

AU - Ivanov, V. V.

PY - 2005

Y1 - 2005

N2 - Dependence of microstructure upon transfer stability of the powder-metallurgy copper-diamond electrical contact material with Cr and Nb addition during type-test process is investigated by optical microscope and SEM observation. During making and breaking process, micro-cracks occurred along grain boundaries under electrical and mechanical forces. Addition of cadmium into the composite increases oxidizable capability of this material, and also leads to oxide accumulation along grain boundaries. These factors reduce the reliability of electrical contacts in practice. Arc erosion quantities during commutation operation processes relates with grain size of matrix and particle size of the second metallic phase. The optimal grain size is 20-50μm and 10-20 μm for niobium particles in these tests.

AB - Dependence of microstructure upon transfer stability of the powder-metallurgy copper-diamond electrical contact material with Cr and Nb addition during type-test process is investigated by optical microscope and SEM observation. During making and breaking process, micro-cracks occurred along grain boundaries under electrical and mechanical forces. Addition of cadmium into the composite increases oxidizable capability of this material, and also leads to oxide accumulation along grain boundaries. These factors reduce the reliability of electrical contacts in practice. Arc erosion quantities during commutation operation processes relates with grain size of matrix and particle size of the second metallic phase. The optimal grain size is 20-50μm and 10-20 μm for niobium particles in these tests.

KW - Copper-based composite

KW - Electrical contact material

KW - Microstructure

KW - Performance

UR - https://www.scopus.com/pages/publications/17044387340

U2 - 10.4028/0-87849-960-1.869

DO - 10.4028/0-87849-960-1.869

M3 - 会议文章

AN - SCOPUS:17044387340

SN - 0255-5476

VL - 475-479

SP - 869

EP - 872

JO - Materials Science Forum

JF - Materials Science Forum

IS - II

T2 - PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing

Y2 - 2 November 2004 through 5 November 2004

ER -

Investigation on microstructure transformation and failure behavior of Cu-Cd-Nb-C_P electrical contact material

Abstract

Keywords

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