Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation

Shuai Zhang; Xuesong Quan; Changhao Lin; Liqiang Cao; Xiangyu Chen; Jinhong Liu; Qingyang Qiu; Sunwu Xu; Peng He; Shuye Zhang

doi:10.1016/j.matlet.2024.137394

Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation

Shuai Zhang
, Xuesong Quan
, Changhao Lin
, Liqiang Cao^*
, Xiangyu Chen
, Jinhong Liu
, Qingyang Qiu
, Sunwu Xu
, Peng He
, Shuye Zhang

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology
CAS - Institute of Microelectronics

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Abstract

The failure mechanism of electromigration (EM) for electronic packaging technology has garnered interest. Electromigration-caused voids reduce electronic device dependability. Two-step reflow at 250℃ and 210℃ was employed to create SAC305/SnPb micro-hybrid solder connections. Finite element analysis confirmed electromigration failure. After 768 h at 10A, the anode interface IMC thickness increased by 149.8 %, while the cathode IMC increased less. Polarity accelerates anode IMC growth. Electromigration of Cu from cathode to anode causes structural flaws and 44.6 % shear strength loss to 35.1 MPa. Fractures shift from inside the solder joint to the IMC layer, becoming brittle. COMSOL simulation demonstrates greatest current density, temperature, and stress at the current inlet and Cu pad-solder joint junction.

Original language	English
Article number	137394
Journal	Materials Letters
Volume	377
DOIs	https://doi.org/10.1016/j.matlet.2024.137394
State	Published - 15 Dec 2024

Keywords

Electromigration
Failure behavior
Micro-hybrid solder joints
Simulation

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10.1016/j.matlet.2024.137394

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@article{4da0114869464781941433b40dcde7eb,

title = "Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation",

abstract = "The failure mechanism of electromigration (EM) for electronic packaging technology has garnered interest. Electromigration-caused voids reduce electronic device dependability. Two-step reflow at 250℃ and 210℃ was employed to create SAC305/SnPb micro-hybrid solder connections. Finite element analysis confirmed electromigration failure. After 768 h at 10A, the anode interface IMC thickness increased by 149.8 \%, while the cathode IMC increased less. Polarity accelerates anode IMC growth. Electromigration of Cu from cathode to anode causes structural flaws and 44.6 \% shear strength loss to 35.1 MPa. Fractures shift from inside the solder joint to the IMC layer, becoming brittle. COMSOL simulation demonstrates greatest current density, temperature, and stress at the current inlet and Cu pad-solder joint junction.",

keywords = "Electromigration, Failure behavior, Micro-hybrid solder joints, Simulation",

author = "Shuai Zhang and Xuesong Quan and Changhao Lin and Liqiang Cao and Xiangyu Chen and Jinhong Liu and Qingyang Qiu and Sunwu Xu and Peng He and Shuye Zhang",

note = "Publisher Copyright: {\textcopyright} 2024 Elsevier B.V.",

year = "2024",

month = dec,

day = "15",

doi = "10.1016/j.matlet.2024.137394",

language = "英语",

volume = "377",

journal = "Materials Letters",

issn = "0167-577X",

publisher = "Elsevier B.V.",

}

TY - JOUR

T1 - Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques

T2 - Experiment and simulation

AU - Zhang, Shuai

AU - Quan, Xuesong

AU - Lin, Changhao

AU - Cao, Liqiang

AU - Chen, Xiangyu

AU - Liu, Jinhong

AU - Qiu, Qingyang

AU - Xu, Sunwu

AU - He, Peng

AU - Zhang, Shuye

PY - 2024/12/15

Y1 - 2024/12/15

N2 - The failure mechanism of electromigration (EM) for electronic packaging technology has garnered interest. Electromigration-caused voids reduce electronic device dependability. Two-step reflow at 250℃ and 210℃ was employed to create SAC305/SnPb micro-hybrid solder connections. Finite element analysis confirmed electromigration failure. After 768 h at 10A, the anode interface IMC thickness increased by 149.8 %, while the cathode IMC increased less. Polarity accelerates anode IMC growth. Electromigration of Cu from cathode to anode causes structural flaws and 44.6 % shear strength loss to 35.1 MPa. Fractures shift from inside the solder joint to the IMC layer, becoming brittle. COMSOL simulation demonstrates greatest current density, temperature, and stress at the current inlet and Cu pad-solder joint junction.

AB - The failure mechanism of electromigration (EM) for electronic packaging technology has garnered interest. Electromigration-caused voids reduce electronic device dependability. Two-step reflow at 250℃ and 210℃ was employed to create SAC305/SnPb micro-hybrid solder connections. Finite element analysis confirmed electromigration failure. After 768 h at 10A, the anode interface IMC thickness increased by 149.8 %, while the cathode IMC increased less. Polarity accelerates anode IMC growth. Electromigration of Cu from cathode to anode causes structural flaws and 44.6 % shear strength loss to 35.1 MPa. Fractures shift from inside the solder joint to the IMC layer, becoming brittle. COMSOL simulation demonstrates greatest current density, temperature, and stress at the current inlet and Cu pad-solder joint junction.

KW - Electromigration

KW - Failure behavior

KW - Micro-hybrid solder joints

KW - Simulation

UR - https://www.scopus.com/pages/publications/85203653842

U2 - 10.1016/j.matlet.2024.137394

DO - 10.1016/j.matlet.2024.137394

M3 - 文章

AN - SCOPUS:85203653842

SN - 0167-577X

VL - 377

JO - Materials Letters

JF - Materials Letters

M1 - 137394

ER -

Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation

Abstract

Keywords

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