Investigation on curing kinetics and thermal properties of new epoxy resin having aromatic heterocyclic ring

Xiao Dong Lu; Yu Dong Huang; Chun Hua Zhang

Investigation on curing kinetics and thermal properties of new epoxy resin having aromatic heterocyclic ring

Xiao Dong Lu^*
, Yu Dong Huang
, Chun Hua Zhang

^*Corresponding author for this work

School of Chemistry and Chemical Engineering

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

Curing procedure, reaction kinetics parameters and thermal resistance of TDE-85/DIABO/DDS was investigated by DSC in this paper. According to Kissinger and Ozawa methods, the average apparent activation energy is 64.63 kJ/mol. Reaction order is 0.95. Glass transition temperature is 261°C by TBA. The onset decomposition temperature is 374.4°C and char resident is 44.58%. The data are raised more 18%, 8% and 50% than TDE/DDS system, respectively.

Original language	English
Pages (from-to)	120-123
Number of pages	4
Journal	Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering
Volume	23
Issue number	6
State	Published - Nov 2007

Keywords

Epoxy resin
Heat resistant
Reaction kinetics

Cite this

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title = "Investigation on curing kinetics and thermal properties of new epoxy resin having aromatic heterocyclic ring",

abstract = "Curing procedure, reaction kinetics parameters and thermal resistance of TDE-85/DIABO/DDS was investigated by DSC in this paper. According to Kissinger and Ozawa methods, the average apparent activation energy is 64.63 kJ/mol. Reaction order is 0.95. Glass transition temperature is 261°C by TBA. The onset decomposition temperature is 374.4°C and char resident is 44.58\%. The data are raised more 18\%, 8\% and 50\% than TDE/DDS system, respectively.",

keywords = "Epoxy resin, Heat resistant, Reaction kinetics",

author = "Lu, \{Xiao Dong\} and Huang, \{Yu Dong\} and Zhang, \{Chun Hua\}",

year = "2007",

month = nov,

language = "英语",

volume = "23",

pages = "120--123",

journal = "Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering",

issn = "1000-7555",

publisher = "Chengdu University of Science and Technology",

number = "6",

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TY - JOUR

T1 - Investigation on curing kinetics and thermal properties of new epoxy resin having aromatic heterocyclic ring

AU - Lu, Xiao Dong

AU - Huang, Yu Dong

AU - Zhang, Chun Hua

PY - 2007/11

Y1 - 2007/11

N2 - Curing procedure, reaction kinetics parameters and thermal resistance of TDE-85/DIABO/DDS was investigated by DSC in this paper. According to Kissinger and Ozawa methods, the average apparent activation energy is 64.63 kJ/mol. Reaction order is 0.95. Glass transition temperature is 261°C by TBA. The onset decomposition temperature is 374.4°C and char resident is 44.58%. The data are raised more 18%, 8% and 50% than TDE/DDS system, respectively.

AB - Curing procedure, reaction kinetics parameters and thermal resistance of TDE-85/DIABO/DDS was investigated by DSC in this paper. According to Kissinger and Ozawa methods, the average apparent activation energy is 64.63 kJ/mol. Reaction order is 0.95. Glass transition temperature is 261°C by TBA. The onset decomposition temperature is 374.4°C and char resident is 44.58%. The data are raised more 18%, 8% and 50% than TDE/DDS system, respectively.

KW - Epoxy resin

KW - Heat resistant

KW - Reaction kinetics

UR - https://www.scopus.com/pages/publications/37449000376

M3 - 文章

AN - SCOPUS:37449000376

SN - 1000-7555

VL - 23

SP - 120

EP - 123

JO - Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering

JF - Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering

IS - 6

ER -

Investigation on curing kinetics and thermal properties of new epoxy resin having aromatic heterocyclic ring

Abstract

Keywords

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