TY - GEN
T1 - Investigation of the Influences of Thermal stresses and Joule Heating within a Piezoresistive MEMS Pressure Sensor using the Finite Element Modeling
AU - Zhou, Chunming
AU - Zhou, Peng
AU - Hu, Yuehua
AU - Zhang, Hao
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/9/14
Y1 - 2021/9/14
N2 - In this paper, the influences of thermal stresses and Joule heating are studied in a piezoresistive MEMS pressure sensor via a 3D finite element model developed in our previous work using FreeFem++. First, a steady state equation of electric currents is solved to determine the electric potential. Second, a quasi-stationary equation of the thermal conduction under the influence of Joule heating is solved to obtain the distribution of the temperature field. Then, the Cauchy-Navier's equations subjected to thermal stresses are solved to find the elastic displacements and thus the elastic strains. As a result, the elastic stresses within the piezoresistors are found; then, using the constitutive equation of the piezoresistive material, the changes in the electrical resistance of the piezoresistors are obtained, which yields the output voltage eventually. During the simulations, the influences on the output voltage from the thermal stresses, Joule heating as well as different size parameters are studied. In the end, a modal analysis of the sensor is performed. The simulation results obtained have the potential to help the design of piezoresistive MEMS pressure sensors and also help to determine the major factors which influence the performance of the sensors.
AB - In this paper, the influences of thermal stresses and Joule heating are studied in a piezoresistive MEMS pressure sensor via a 3D finite element model developed in our previous work using FreeFem++. First, a steady state equation of electric currents is solved to determine the electric potential. Second, a quasi-stationary equation of the thermal conduction under the influence of Joule heating is solved to obtain the distribution of the temperature field. Then, the Cauchy-Navier's equations subjected to thermal stresses are solved to find the elastic displacements and thus the elastic strains. As a result, the elastic stresses within the piezoresistors are found; then, using the constitutive equation of the piezoresistive material, the changes in the electrical resistance of the piezoresistors are obtained, which yields the output voltage eventually. During the simulations, the influences on the output voltage from the thermal stresses, Joule heating as well as different size parameters are studied. In the end, a modal analysis of the sensor is performed. The simulation results obtained have the potential to help the design of piezoresistive MEMS pressure sensors and also help to determine the major factors which influence the performance of the sensors.
KW - Finite Element Modeling
KW - Joule heating
KW - Piezoresistive sensor
KW - Thermal stress
UR - https://www.scopus.com/pages/publications/85118450689
U2 - 10.1109/ICEPT52650.2021.9568015
DO - 10.1109/ICEPT52650.2021.9568015
M3 - 会议稿件
AN - SCOPUS:85118450689
T3 - 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
BT - 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
Y2 - 14 September 2021 through 17 September 2021
ER -