Skip to main navigation Skip to search Skip to main content

Investigation of surface roughness prediction in single-point diamond turning

  • Qingliang Zhao*
  • , Junyun Chen
  • , Jian Luo
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Experimental results indicate the previous theoretical model cannot predict well the surface roughness in single-point diamond turning on a precision lathe. In solving that, an improved model was presented in this paper. The difference between the previous model and the improved model is that the relative tool-workpiece vibration is measured before cutting operation using a capacitive displacement sensor in the previous model whilst the vibration is extracted from the measured surface profile in the improved model. The relative vibration was first studied under various cutting conditions to establish the vibration modes under corresponding cutting conditions. Then the surface roughness was predicted based on the vibration modes. The results prove that there is good agreement between the predicted values and measured values and the improved model is useful and reliable.

Original languageEnglish
Title of host publicationMaterials Processing Technologies
Pages856-861
Number of pages6
DOIs
StatePublished - 2011
Event2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010 - Shenzhen, China
Duration: 6 Nov 20108 Nov 2010

Publication series

NameAdvanced Materials Research
Volume154-155
ISSN (Print)1022-6680

Conference

Conference2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010
Country/TerritoryChina
CityShenzhen
Period6/11/108/11/10

Keywords

  • Prediction model
  • Single-point diamond turning
  • Surface roughness
  • Vibration

Fingerprint

Dive into the research topics of 'Investigation of surface roughness prediction in single-point diamond turning'. Together they form a unique fingerprint.

Cite this