@inproceedings{a3cf9d4424814e5cb261493b9f96feeb,
title = "Investigation of moisture diffusion in plastic electronic packages by molecular dynamics simulation",
abstract = "Moisture absorption results in a variety of failures to plastic packaging devices. In order to gain insight the mechanism, it is necessary to carry out a molecular level investigation. In this paper, molecular dynamics (MD) simulations were conducted to investigate the moisture diffusion coefficients of the moisture into the epoxy molding compound (EMC) and the EMC/Cu interface at different temperatures and with different amount of moisture absorbed by the system. The results show that the diffusion coefficient increases at high temperature and with a low amount of moisture containing in the EMC. At the same condition, the diffusion coefficient of moisture through the interface of EMC/Cu is higher than in the EMC. Also, the hydrogen bonds were found to play a significant role at elevated temperatures in increasing the diffusion coefficient.",
keywords = "hydrogen bond, moisture diffusion coefficient, molecular dynamics simulation",
author = "Yue Zhang and Chenxi Wang and Zhitian Yuan and Yanhong Tian and Guoliang Fan and Jason Guo",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 18th International Conference on Electronic Packaging Technology, ICEPT 2017 ; Conference date: 16-08-2017 Through 19-08-2017",
year = "2017",
month = sep,
day = "19",
doi = "10.1109/ICEPT.2017.8046748",
language = "英语",
series = "18th International Conference on Electronic Packaging Technology, ICEPT 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1626--1630",
editor = "Chenxi Wang and Yanhong Tian and Tianchun Ye",
booktitle = "18th International Conference on Electronic Packaging Technology, ICEPT 2017",
address = "美国",
}