Investigation of high-temperature deformation behavior of a SiC whisker reinforced 6061 aluminium composite

Z. Xiong; L. Geng; C. K. Yao

doi:10.1016/0266-3538(90)90050-F

Investigation of high-temperature deformation behavior of a SiC whisker reinforced 6061 aluminium composite

Z. Xiong
, L. Geng
, C. K. Yao^*

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

46 Scopus citations

Abstract

The high-temperature deformation behavior of silicon carbide whisker reinforced 6061 aluminium alloy composite has been studied by means of compressive tests. The experimental results have shown that the critical reduction of the SiC_w/6061Al composite (the value of the compressive deformation that causes sample cracking) increases with increase of the deformation temperature and decreases with increase in the deformation ratio. There is a peak in the compressive stress-strain curves of the SiC_w/6061Al composite, which is caused by whisker rotation rather than being a sign of recrystallization.

Original language	English
Pages (from-to)	117-125
Number of pages	9
Journal	Composites Science and Technology
Volume	39
Issue number	2
DOIs	https://doi.org/10.1016/0266-3538(90)90050-F
State	Published - 1990

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title = "Investigation of high-temperature deformation behavior of a SiC whisker reinforced 6061 aluminium composite",

abstract = "The high-temperature deformation behavior of silicon carbide whisker reinforced 6061 aluminium alloy composite has been studied by means of compressive tests. The experimental results have shown that the critical reduction of the SiCw/6061Al composite (the value of the compressive deformation that causes sample cracking) increases with increase of the deformation temperature and decreases with increase in the deformation ratio. There is a peak in the compressive stress-strain curves of the SiCw/6061Al composite, which is caused by whisker rotation rather than being a sign of recrystallization.",

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AU - Xiong, Z.

AU - Geng, L.

AU - Yao, C. K.

PY - 1990

Y1 - 1990

N2 - The high-temperature deformation behavior of silicon carbide whisker reinforced 6061 aluminium alloy composite has been studied by means of compressive tests. The experimental results have shown that the critical reduction of the SiCw/6061Al composite (the value of the compressive deformation that causes sample cracking) increases with increase of the deformation temperature and decreases with increase in the deformation ratio. There is a peak in the compressive stress-strain curves of the SiCw/6061Al composite, which is caused by whisker rotation rather than being a sign of recrystallization.

AB - The high-temperature deformation behavior of silicon carbide whisker reinforced 6061 aluminium alloy composite has been studied by means of compressive tests. The experimental results have shown that the critical reduction of the SiCw/6061Al composite (the value of the compressive deformation that causes sample cracking) increases with increase of the deformation temperature and decreases with increase in the deformation ratio. There is a peak in the compressive stress-strain curves of the SiCw/6061Al composite, which is caused by whisker rotation rather than being a sign of recrystallization.

UR - https://www.scopus.com/pages/publications/0025590723

U2 - 10.1016/0266-3538(90)90050-F

DO - 10.1016/0266-3538(90)90050-F

M3 - 文章

AN - SCOPUS:0025590723

SN - 0266-3538

VL - 39

SP - 117

EP - 125

JO - Composites Science and Technology

JF - Composites Science and Technology

IS - 2

ER -

Investigation of high-temperature deformation behavior of a SiC whisker reinforced 6061 aluminium composite

Abstract

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