Investigation of electrostatic bonding time model with point cathode

Jialu Tang; Xiaowei Liu; Haifeng Zhang; Xilian Wang

doi:10.1109/NEMS.2009.5068764

Investigation of electrostatic bonding time model with point cathode

Jialu Tang^*
, Xiaowei Liu
, Haifeng Zhang
, Xilian Wang

^*Corresponding author for this work

School of Astronautics

Harbin Institute of Technology
No 1 flight college of Air Force

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

This paper discusses a novel method of modeling and simulation of anodic bonding technique, which is widely used in fabrication of MEMS device and micro system. The emphasis are the bond expansion model and extended time formula of silicon-glass anodic bonding, and based on which, visual simulation of the process is achieved. In practical experiments, by utilizing the math model, simulation result matches well with the real process, perfectly displaying the electricity characteristics. This novel approach of simulation possesses high practicality, and additionally, will be important and valuable in the development ofMEMS technology and microelectronics.

Original language	English
Title of host publication	4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009
Pages	1096-1098
Number of pages	3
DOIs	https://doi.org/10.1109/NEMS.2009.5068764
State	Published - 2009
Event	4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009 - Shenzhen, China Duration: 5 Jan 2009 → 8 Jan 2009

Publication series

Name	4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009

Conference

Conference	4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009
Country/Territory	China
City	Shenzhen
Period	5/01/09 → 8/01/09

Keywords

Anodic bonding
MEMS
Process simulation

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10.1109/NEMS.2009.5068764

Cite this

Tang, J., Liu, X., Zhang, H., & Wang, X. (2009). Investigation of electrostatic bonding time model with point cathode. In 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009 (pp. 1096-1098). Article 5068764 (4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009). https://doi.org/10.1109/NEMS.2009.5068764

@inproceedings{3159fbb7b1094468a0b8a1dedb2e8b67,

title = "Investigation of electrostatic bonding time model with point cathode",

abstract = "This paper discusses a novel method of modeling and simulation of anodic bonding technique, which is widely used in fabrication of MEMS device and micro system. The emphasis are the bond expansion model and extended time formula of silicon-glass anodic bonding, and based on which, visual simulation of the process is achieved. In practical experiments, by utilizing the math model, simulation result matches well with the real process, perfectly displaying the electricity characteristics. This novel approach of simulation possesses high practicality, and additionally, will be important and valuable in the development ofMEMS technology and microelectronics.",

keywords = "Anodic bonding, MEMS, Process simulation",

author = "Jialu Tang and Xiaowei Liu and Haifeng Zhang and Xilian Wang",

year = "2009",

doi = "10.1109/NEMS.2009.5068764",

language = "英语",

isbn = "9781424446308",

series = "4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009",

pages = "1096--1098",

booktitle = "4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009",

note = "4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009 ; Conference date: 05-01-2009 Through 08-01-2009",

}

Tang, J, Liu, X, Zhang, H & Wang, X 2009, Investigation of electrostatic bonding time model with point cathode. in 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009., 5068764, 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009, pp. 1096-1098, 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009, Shenzhen, China, 5/01/09. https://doi.org/10.1109/NEMS.2009.5068764

Investigation of electrostatic bonding time model with point cathode. / Tang, Jialu; Liu, Xiaowei; Zhang, Haifeng et al.
4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009. 2009. p. 1096-1098 5068764 (4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Investigation of electrostatic bonding time model with point cathode

AU - Tang, Jialu

AU - Liu, Xiaowei

AU - Zhang, Haifeng

AU - Wang, Xilian

PY - 2009

Y1 - 2009

N2 - This paper discusses a novel method of modeling and simulation of anodic bonding technique, which is widely used in fabrication of MEMS device and micro system. The emphasis are the bond expansion model and extended time formula of silicon-glass anodic bonding, and based on which, visual simulation of the process is achieved. In practical experiments, by utilizing the math model, simulation result matches well with the real process, perfectly displaying the electricity characteristics. This novel approach of simulation possesses high practicality, and additionally, will be important and valuable in the development ofMEMS technology and microelectronics.

AB - This paper discusses a novel method of modeling and simulation of anodic bonding technique, which is widely used in fabrication of MEMS device and micro system. The emphasis are the bond expansion model and extended time formula of silicon-glass anodic bonding, and based on which, visual simulation of the process is achieved. In practical experiments, by utilizing the math model, simulation result matches well with the real process, perfectly displaying the electricity characteristics. This novel approach of simulation possesses high practicality, and additionally, will be important and valuable in the development ofMEMS technology and microelectronics.

KW - Anodic bonding

KW - MEMS

KW - Process simulation

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U2 - 10.1109/NEMS.2009.5068764

DO - 10.1109/NEMS.2009.5068764

M3 - 会议稿件

AN - SCOPUS:70349676210

SN - 9781424446308

T3 - 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009

SP - 1096

EP - 1098

BT - 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009

T2 - 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009

Y2 - 5 January 2009 through 8 January 2009

ER -

Investigation of electrostatic bonding time model with point cathode

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