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Investigation into the role of Si and SiC phases in RB-SiC ceramics surface modified ultra-precision grinding

  • Jiabin Xu
  • , Qiongyi He
  • , Xiangyu Zhang
  • , Xiude Yi
  • , Yang Yu
  • , Yingjie Li
  • , Long Zhang*
  • , Runrun Gu*
  • , Feihu Zhang*
  • *Corresponding author for this work
  • School of Mechatronics Engineering, Harbin Institute of Technology
  • TianJin University of Technology and Education
  • CAS - Changchun Institute of Optics Fine Mechanics and Physics
  • Southwest University
  • Shanghai Jiao Tong University
  • Xinjiang Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

RB-SiC ceramic has greater specific stiffness and thermal stability as space optical materials in the field of deep space exploration. To ultra-precision grinding advanced manufacturing technology drawbacks, a fabrication of highly shape accuracy and surface quality and surface modification assisted processing at room temperature. The RB-SiC ceramics are modified by plasma torches to produce compounds with lower hardness values, an exceptional surface quality (Sa surface roughness of [0.481, 0.959]), and has excellent thermal and chemical stability after surface modification process via 100 °C plasma torch at room temperature environment, which makes it an ideal suitable for the deep space exploration conditions such as space optical materials. In addition, oxygen(O2) plasma surface modification and finite element simulation force-heat conduction of RB-SiC ceramic hard-brittle materials surface grinding force were compared with advanced manufacturing experiments of the precision grinding, revealing the formation mechanism and influence mechanism of surface micro-morphology during micro-cutting of precision grinding finish surface. The advanced manufacturing precision grinding difficulties of RB-SiC ceramic oxygen plasma torch reducing subsurface damage and removing space optical hard-brittle materials via ultra-precision grinding process of resin-funded corundum grinding wheel were solved. Subsurface damage (SSD) was effectively inhibited and its formation mechanism model.

Original languageEnglish
Article number108786
JournalMaterials Science in Semiconductor Processing
Volume184
DOIs
StatePublished - Dec 2024
Externally publishedYes

Keywords

  • Hard-brittle material
  • RB-SiC ceramic
  • Subsurface damage
  • Ultra-precision grinding

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