Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics

Yarong Chen; Meng Yang; Binbin Zhang; Rong An

doi:10.1109/ICEPT-HDP.2012.6474597

Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics

Yarong Chen^*
, Meng Yang
, Binbin Zhang
, Rong An

^*Corresponding author for this work

Faculty of Life Sciences and Medicine

Beijing Spacecrafts
Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The heat-sink interfacial reaction of Sn-90Pb, Sn-95Pb, Sn-37Pb solders are contrast with the Sn-3.0Ag-0.5Cu solder in vacuum soldering and reflow soldering in this paper, to find the matching solder combination. Results show that, Sn-90Pb, Sn-95Pb solders are not the good choices for Al₂O ₃/MoCu in vacuum soldering. Sn-3.0Ag-0.5Cu and Sn-37Pb solders can be used in the vacuum soldering, and Sn-37Pb solder is the best choice as the leaded solders for space use.

Original language	English
Title of host publication	ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
Pages	186-188
Number of pages	3
DOIs	https://doi.org/10.1109/ICEPT-HDP.2012.6474597
State	Published - 2012
Event	2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012 - Guilin, China Duration: 13 Aug 2012 → 16 Aug 2012

Publication series

Name	ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging

Conference

Conference	2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012
Country/Territory	China
City	Guilin
Period	13/08/12 → 16/08/12

Access to Document

10.1109/ICEPT-HDP.2012.6474597

Cite this

Chen, Y., Yang, M., Zhang, B., & An, R. (2012). Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics. In ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging (pp. 186-188). Article 6474597 (ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging). https://doi.org/10.1109/ICEPT-HDP.2012.6474597

Chen, Yarong ; Yang, Meng ; Zhang, Binbin et al. / Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics. ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. 2012. pp. 186-188 (ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging).

@inproceedings{99de4785d3794208bf924f059b721362,

title = "Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics",

abstract = "The heat-sink interfacial reaction of Sn-90Pb, Sn-95Pb, Sn-37Pb solders are contrast with the Sn-3.0Ag-0.5Cu solder in vacuum soldering and reflow soldering in this paper, to find the matching solder combination. Results show that, Sn-90Pb, Sn-95Pb solders are not the good choices for Al2O 3/MoCu in vacuum soldering. Sn-3.0Ag-0.5Cu and Sn-37Pb solders can be used in the vacuum soldering, and Sn-37Pb solder is the best choice as the leaded solders for space use.",

author = "Yarong Chen and Meng Yang and Binbin Zhang and Rong An",

year = "2012",

doi = "10.1109/ICEPT-HDP.2012.6474597",

language = "英语",

isbn = "9781467316804",

series = "ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging",

pages = "186--188",

booktitle = "ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging",

note = "2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012 ; Conference date: 13-08-2012 Through 16-08-2012",

}

Chen, Y, Yang, M, Zhang, B & An, R 2012, Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics. in ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging., 6474597, ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, pp. 186-188, 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, Guilin, China, 13/08/12. https://doi.org/10.1109/ICEPT-HDP.2012.6474597

Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics. / Chen, Yarong; Yang, Meng; Zhang, Binbin et al.
ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. 2012. p. 186-188 6474597 (ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Chen, Yarong

AU - Yang, Meng

AU - Zhang, Binbin

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PY - 2012

Y1 - 2012

N2 - The heat-sink interfacial reaction of Sn-90Pb, Sn-95Pb, Sn-37Pb solders are contrast with the Sn-3.0Ag-0.5Cu solder in vacuum soldering and reflow soldering in this paper, to find the matching solder combination. Results show that, Sn-90Pb, Sn-95Pb solders are not the good choices for Al2O 3/MoCu in vacuum soldering. Sn-3.0Ag-0.5Cu and Sn-37Pb solders can be used in the vacuum soldering, and Sn-37Pb solder is the best choice as the leaded solders for space use.

AB - The heat-sink interfacial reaction of Sn-90Pb, Sn-95Pb, Sn-37Pb solders are contrast with the Sn-3.0Ag-0.5Cu solder in vacuum soldering and reflow soldering in this paper, to find the matching solder combination. Results show that, Sn-90Pb, Sn-95Pb solders are not the good choices for Al2O 3/MoCu in vacuum soldering. Sn-3.0Ag-0.5Cu and Sn-37Pb solders can be used in the vacuum soldering, and Sn-37Pb solder is the best choice as the leaded solders for space use.

UR - https://www.scopus.com/pages/publications/84875456195

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DO - 10.1109/ICEPT-HDP.2012.6474597

M3 - 会议稿件

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BT - ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging

T2 - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012

Y2 - 13 August 2012 through 16 August 2012

ER -

Chen Y, Yang M, Zhang B, An R. Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics. In ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. 2012. p. 186-188. 6474597. (ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging). doi: 10.1109/ICEPT-HDP.2012.6474597

Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics

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