TY - GEN
T1 - Interfacial reaction between PBGA solder balls and Au / Ni /Cu pad during laser reflow bumping
AU - Tian, Yanhong
AU - Wang, Chunqing
PY - 2001
Y1 - 2001
N2 - In this paper, formation and growth of intermetallic compounds in Cu/Ni/Au/PbSn solder bump via laser reflow was investigated. Effects of laser radiation time on the growth of intermetallic compounds at solder/Au/Ni/Cu pad interface were studied by SEM. Dissolution and diffusion of Au and Sn inside the solder bump within laser heating time was analyzed by AES. it was shown that reaction zone consists of two continuous AuSn2 and AuSn 4 intermetallic layers, identified by EDX, when laser heating time was 50ms under 20W. With the laser reflow time increasing to 200ms, all AuSn2 converts into AuSn4, and some acicular AuSn 4 intermetallics grow form the continuous AuSn4 layer into the solder, aligning perpendicularly to the interface. AES results showed that Au atoms dissolve rapidly into the solder upon laser heating. As a result, the concentration of Au reaches its solubility limit within 50ms, which explains why Au-Sn intermetallic can form and grow at interface in such short time.
AB - In this paper, formation and growth of intermetallic compounds in Cu/Ni/Au/PbSn solder bump via laser reflow was investigated. Effects of laser radiation time on the growth of intermetallic compounds at solder/Au/Ni/Cu pad interface were studied by SEM. Dissolution and diffusion of Au and Sn inside the solder bump within laser heating time was analyzed by AES. it was shown that reaction zone consists of two continuous AuSn2 and AuSn 4 intermetallic layers, identified by EDX, when laser heating time was 50ms under 20W. With the laser reflow time increasing to 200ms, all AuSn2 converts into AuSn4, and some acicular AuSn 4 intermetallics grow form the continuous AuSn4 layer into the solder, aligning perpendicularly to the interface. AES results showed that Au atoms dissolve rapidly into the solder upon laser heating. As a result, the concentration of Au reaches its solubility limit within 50ms, which explains why Au-Sn intermetallic can form and grow at interface in such short time.
UR - https://www.scopus.com/pages/publications/0347569531
M3 - 会议稿件
AN - SCOPUS:0347569531
SN - 0791835405
T3 - Advances in Electronic Packaging
SP - 287
EP - 290
BT - Advances in Electronic Packaging; Electrical Design, Simulation, and Test, Mems, Materials and Processing, Modeling and Characterization
T2 - Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition
Y2 - 8 July 2001 through 13 July 2001
ER -