Interfacial reaction behavior and bonding mechanism between liquid Sn and ZrO₂ ceramic exposed in ultrasonic waves

Ultrasound-assisted dipping of ZrO₂ ceramics into molten Sn solder was performed to realize the low-temperature joining of ZrO₂ ceramics in this study. Scanning electron microscopy with energy dispersive spectrometer, X-ray diffraction and X-ray photoelectron spectroscopy were employed to study the effects of ultrasonic vibration on the microstructure of Sn/ZrO₂ interface, and to elucidate the joining mechanism between Sn coating layer and ZrO₂ ceramic. Results showed that, after ultrasonically dipping in molten Sn for 1200 s, a pure Sn solder layer with a thickness of approximately 8–9 µm was coated on the ZrO₂ surface. The Sn coating layer exhibited excellent metallurgic bonding with ZrO₂ ceramic. A nano-sized ZrSnO₄ ternary phase, which was beneficial to the smooth transition of the lattice from Sn solder to ZrO₂ ceramic, was formed at the Sn/ZrO₂ interface. The formation of ZrSnO₄ interlayer was ascribed to the acoustic cavitation induced high-temperature reaction of Sn, O and ZrO₂ at the molten Sn/ZrO₂ ceramic interface. The tested average shear strength of ZrO₂/Sn/ZrO₂ joints was approximately 32 MPa, and the shearing failure mainly took place within the Sn solder layer.