Interfacial nano-mechanical properties of copper joints bonded with silver nanopaste near room temperature

Peng Peng; Peng He; Guisheng Zou; Lei Liu; Y. Norman Zhou

doi:10.2320/matertrans.MI201412

Interfacial nano-mechanical properties of copper joints bonded with silver nanopaste near room temperature

Peng Peng^*
, Peng He
, Guisheng Zou
, Lei Liu
, Y. Norman Zhou

^*Corresponding author for this work

School of Materials Science and Engineering

University of Waterloo
Tsinghua University
Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

Sintering of nanomaterials at low temperatures has been demonstrated as an alternative for flexible electronic packaging. Silver nanowires were synthesized via polyol method and used as filler material for bonding copper to copper near room temperature. The experimental results indicated that both silver-to-silver and copper-to-silver formed metallurgical bonds. The elastic modulus and nano-hardness of copper joints at the copper-silver interface were characterized using nanoindentation. A transition layer at the interface was observed and its thickness was determined. Sintered silver filler material showed good elasticity both inside and out of the transition layer.

Original language	English
Pages (from-to)	1010-1014
Number of pages	5
Journal	Materials Transactions
Volume	56
Issue number	7
DOIs	https://doi.org/10.2320/matertrans.MI201412
State	Published - 2015

Keywords

Diffusion
Electronic packaging
Hardness
Interface
Mechanical properties

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title = "Interfacial nano-mechanical properties of copper joints bonded with silver nanopaste near room temperature",

abstract = "Sintering of nanomaterials at low temperatures has been demonstrated as an alternative for flexible electronic packaging. Silver nanowires were synthesized via polyol method and used as filler material for bonding copper to copper near room temperature. The experimental results indicated that both silver-to-silver and copper-to-silver formed metallurgical bonds. The elastic modulus and nano-hardness of copper joints at the copper-silver interface were characterized using nanoindentation. A transition layer at the interface was observed and its thickness was determined. Sintered silver filler material showed good elasticity both inside and out of the transition layer.",

keywords = "Diffusion, Electronic packaging, Hardness, Interface, Mechanical properties",

author = "Peng Peng and Peng He and Guisheng Zou and Lei Liu and Zhou, \{Y. Norman\}",

note = "Publisher Copyright: {\textcopyright} 2015 The Japan Institute of Metals and Materials.",

year = "2015",

doi = "10.2320/matertrans.MI201412",

language = "英语",

volume = "56",

pages = "1010--1014",

journal = "Materials Transactions",

issn = "1345-9678",

publisher = "Japan Institute of Metals (JIM)",

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}

TY - JOUR

T1 - Interfacial nano-mechanical properties of copper joints bonded with silver nanopaste near room temperature

AU - Peng, Peng

AU - He, Peng

AU - Zou, Guisheng

AU - Liu, Lei

AU - Zhou, Y. Norman

PY - 2015

Y1 - 2015

N2 - Sintering of nanomaterials at low temperatures has been demonstrated as an alternative for flexible electronic packaging. Silver nanowires were synthesized via polyol method and used as filler material for bonding copper to copper near room temperature. The experimental results indicated that both silver-to-silver and copper-to-silver formed metallurgical bonds. The elastic modulus and nano-hardness of copper joints at the copper-silver interface were characterized using nanoindentation. A transition layer at the interface was observed and its thickness was determined. Sintered silver filler material showed good elasticity both inside and out of the transition layer.

AB - Sintering of nanomaterials at low temperatures has been demonstrated as an alternative for flexible electronic packaging. Silver nanowires were synthesized via polyol method and used as filler material for bonding copper to copper near room temperature. The experimental results indicated that both silver-to-silver and copper-to-silver formed metallurgical bonds. The elastic modulus and nano-hardness of copper joints at the copper-silver interface were characterized using nanoindentation. A transition layer at the interface was observed and its thickness was determined. Sintered silver filler material showed good elasticity both inside and out of the transition layer.

KW - Diffusion

KW - Electronic packaging

KW - Hardness

KW - Interface

KW - Mechanical properties

UR - https://www.scopus.com/pages/publications/84933567247

U2 - 10.2320/matertrans.MI201412

DO - 10.2320/matertrans.MI201412

M3 - 文章

AN - SCOPUS:84933567247

SN - 1345-9678

VL - 56

SP - 1010

EP - 1014

JO - Materials Transactions

JF - Materials Transactions

IS - 7

ER -

Interfacial nano-mechanical properties of copper joints bonded with silver nanopaste near room temperature

Abstract

Keywords

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