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Interfacial microstructure and reaction mechanism with various weld fillers on laser welding-brazing of Al/Cu lap joint

  • Zhenglong Lei*
  • , Xinrui Zhang
  • , Jinge Liu
  • , Peng Li
  • *Corresponding author for this work
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

The influence of pure Al, Al-Si and Zn-Al weld fillers on microstructure and mechanical properties was investigated during lap laser welding-brazing of Al to Cu. Al4.2Cu3.2Zn0.7 IMC layer and plate-like Al2Cu phase were observed at Al/Cu interface with pure Al and Al-Si weld fillers. Microcrack was easy to generate in Al2Cu phase decreasing the joint strength. When the Zn-Al weld filler was adopted, the formation of Al2Cu brittle phase was limited by low Al content and the CuZn and CuZn5 IMC layers were observed at Al/Cu interface. According to the chemical potential, the diffusivity of Cu atoms in Zn-Al weld filler was much lower than that of pure Al and Al-Si weld fillers, which prevented from the formation of coppery phases near the Al/Cu interface. Si atoms tended to concentrate at Al/Cu interface. It played a role in obstructing the diffusion of Cu atoms, enhancing the Al/Cu joint strength to some extent. According to nanoindentation result, the mechanical property of the formed phases (CuZn and CuZn5) in the case of Zn-Al weld filler was better than that formed with pure Al and Al-Si weld fillers such as Al2Cu and Al4.2Cu3.2Zn0.7. The highest tensile strength was 148 MPa with Zn-Al weld filler.

Original languageEnglish
Pages (from-to)226-240
Number of pages15
JournalJournal of Manufacturing Processes
Volume67
DOIs
StatePublished - Jul 2021

Keywords

  • Aluminium alloy
  • Copper alloy
  • Interfacial reaction
  • Laser welding-brazing
  • Metallurgical bonding

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