Skip to main navigation Skip to search Skip to main content

Interfacial microstructure and mechanical properties of porous-Si3N4 ceramic and TiAl alloy joints vacuum brazed with AgCu filler

  • Harbin Institute of Technology
  • Harbin Institute of Technology
  • China Aerospace Science and Technology Corporation

Research output: Contribution to journalArticlepeer-review

Abstract

Porous Si3N4 ceramic was firstly joined to TiAl alloy using an AgCu filler alloy. The effects of brazing temperature and holding time on the interfacial microstructure and mechanical properties of porous-Si3N4/AgCu/TiAl joints were studied. The typical interfacial microstructure of joints brazed at 880 °C for 15 min was TiAl/AlCu2Ti/Ag-Cu eutectic/penetration layer (Ti5Si3+TiN, Si3N4, Ag (s, s), Cu (s, s))/porous-Si3N4. The penetration layer was formed firstly in the brazing process. With increasing brazing temperature and time, the thickness of the penetration layer increased. A large amount of element Ti was consumed in the penetration layer which suppressed the formation and growth of other intermetallic compounds. The penetration layer led the fracture to propagate in the porous Si3N4 ceramic substrate. The maximum shear strength was ~13.56 MPa.

Original languageEnglish
Pages (from-to)9738-9745
Number of pages8
JournalCeramics International
Volume43
Issue number13
DOIs
StatePublished - 2017

Keywords

  • Brazing
  • Interfacial microstructure
  • Mechanical property
  • Porous SiN ceramic
  • TiAl alloy

Fingerprint

Dive into the research topics of 'Interfacial microstructure and mechanical properties of porous-Si3N4 ceramic and TiAl alloy joints vacuum brazed with AgCu filler'. Together they form a unique fingerprint.

Cite this