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Interfacial microstructure and joining properties of TiAl/Si3N4 brazed joints

  • Heilongjiang Institute of Technology
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

Brazing titanium aluminide to silicon nitride was realized by using inactive AgCu filler metal. The effect of the brazing temperature on the interfacial microstructure and joining strength was investigated. The typical interfacial microstructure of the joint was TiAl/B2 phase/AlCuTi/AlCu2Ti/Ag(s,s)+AlCu2Ti/TiN+Ti5Si3/Si3N4. With an increase of the brazing temperature, the distribution of granular AlCu2Ti intermetallics at the center obviously changed and the thickness of TiN+Ti5Si3 layer adjacent to silicon nitride substrate increased simultaneously. The highest shear strength of 124.6MPa was achieved with 1133K brazing temperature and 5min holding time. In addition, the nucleation of tiny Al3V intermetallics for the precipitation of AlCu2Ti phase was found, which was confirmed beneficial for improving the joining properties.

Original languageEnglish
Pages (from-to)7030-7035
Number of pages6
JournalMaterials Science and Engineering: A
Volume528
Issue number22-23
DOIs
StatePublished - 25 Aug 2011

Keywords

  • Brazing
  • Interfacial microstructure
  • Mechanical properties
  • Silicon nitride
  • Titanium aluminide

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