TY - GEN
T1 - Interfacial characterization and bonding mechanism of ultrasonic wedge bonding
AU - Ji, Hongjun
AU - Li, Mingyu
AU - Wang, Chunqing
PY - 2006
Y1 - 2006
N2 - The joining mechanism of ultrasonic wedge bonding was investigated by chemical etching method. Compared to peeling-off method, the advantage of chemical etching method not only reflected the characters of the bond interface, but also indicated the physical process and bonding mechanism of the interconnection between the metal wire and metallization. It was found that the evolution and characters of the bond interface were affected heavily by the bonding parameters. The lateral and longitudinal joint marks were observed. The former were perpendicular to the direction of the ultrasonic vibration, and distributed at the periphery of the bond interface with some periodicity, which were the metallurgical joining parts. However, the later were parallel to the vibration directions locating at the bond center. The features above had important influence on the bond resistance. The mechanism was ascribed to the stress evolution and distribution during bonding process.
AB - The joining mechanism of ultrasonic wedge bonding was investigated by chemical etching method. Compared to peeling-off method, the advantage of chemical etching method not only reflected the characters of the bond interface, but also indicated the physical process and bonding mechanism of the interconnection between the metal wire and metallization. It was found that the evolution and characters of the bond interface were affected heavily by the bonding parameters. The lateral and longitudinal joint marks were observed. The former were perpendicular to the direction of the ultrasonic vibration, and distributed at the periphery of the bond interface with some periodicity, which were the metallurgical joining parts. However, the later were parallel to the vibration directions locating at the bond center. The features above had important influence on the bond resistance. The mechanism was ascribed to the stress evolution and distribution during bonding process.
UR - https://www.scopus.com/pages/publications/34948889687
U2 - 10.1109/ICEPT.2006.359760
DO - 10.1109/ICEPT.2006.359760
M3 - 会议稿件
AN - SCOPUS:34948889687
SN - 142440620X
SN - 9781424406203
T3 - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
BT - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
PB - IEEE Computer Society
T2 - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
Y2 - 26 August 2006 through 29 August 2006
ER -