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Interfacial behavior of SiO2 ceramic/TC4 brazed joint

  • Harbin Institute of Technology Weihai
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

SiO2/TC4 brazed joint was obtained by adopting AgCu/Ni composite interlayer filler, and thus a fine joint was formed. A home-made AgCuTiNi active filler which began to melt at 909.1℃ was used to brazing SiO2 ceramics, and a good connection was formed. The effect of the Ti activities on interfacial behavior of the ceramic side in SiO2/TC4 brazed joint was discussed by using SEM, XRD and other methods to analyze the interfacial microstructure of the two brazed joints mentioned above. It turned out that, the typical interfacial microstructure of TC4/ AgCu/Ni/SiO2 brazed joint was: TC4 /Ti(s, s)+Ti2(Ni, Cu)+Ti2(Cu, Ni)/Ti4O7+TiSi2/SiO2; the typical interfacial microstructure of AgCuTiNi/SiO2 sample was: Ti2(Cu, Ni)/ Ti(s, s)+Ti2(Ni, Cu)+Ti2(Cu, Ni)/Ti4O7+ TiSi2/ SiO2. The thickness of reaction layer at the SiO2 ceramic side was increased obviously with the Ti activities enhanced when the joints were brazed at 970℃ and held for same time. The thickness of reaction layer at SiO2 ceramic side increased with the holding time prolonged at 970℃.

Original languageEnglish
Pages (from-to)39-42
Number of pages4
JournalHanjie Xuebao/Transactions of the China Welding Institution
Volume38
Issue number10
DOIs
StatePublished - 25 Oct 2017

Keywords

  • Active filler metal
  • Brazing
  • Interfacial microstructure
  • SiO ceramic
  • TC4 alloy

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