Abstract
SiO2/TC4 brazed joint was obtained by adopting AgCu/Ni composite interlayer filler, and thus a fine joint was formed. A home-made AgCuTiNi active filler which began to melt at 909.1℃ was used to brazing SiO2 ceramics, and a good connection was formed. The effect of the Ti activities on interfacial behavior of the ceramic side in SiO2/TC4 brazed joint was discussed by using SEM, XRD and other methods to analyze the interfacial microstructure of the two brazed joints mentioned above. It turned out that, the typical interfacial microstructure of TC4/ AgCu/Ni/SiO2 brazed joint was: TC4 /Ti(s, s)+Ti2(Ni, Cu)+Ti2(Cu, Ni)/Ti4O7+TiSi2/SiO2; the typical interfacial microstructure of AgCuTiNi/SiO2 sample was: Ti2(Cu, Ni)/ Ti(s, s)+Ti2(Ni, Cu)+Ti2(Cu, Ni)/Ti4O7+ TiSi2/ SiO2. The thickness of reaction layer at the SiO2 ceramic side was increased obviously with the Ti activities enhanced when the joints were brazed at 970℃ and held for same time. The thickness of reaction layer at SiO2 ceramic side increased with the holding time prolonged at 970℃.
| Original language | English |
|---|---|
| Pages (from-to) | 39-42 |
| Number of pages | 4 |
| Journal | Hanjie Xuebao/Transactions of the China Welding Institution |
| Volume | 38 |
| Issue number | 10 |
| DOIs | |
| State | Published - 25 Oct 2017 |
Keywords
- Active filler metal
- Brazing
- Interfacial microstructure
- SiO ceramic
- TC4 alloy
Fingerprint
Dive into the research topics of 'Interfacial behavior of SiO2 ceramic/TC4 brazed joint'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver