Interface structure and mechanical performance of TLP bonded joints of Al2O3p/6061Al composites using Cu/Ni composite interlayers

Jiuchun Yan; Zhiwu Xu; Gaohui Wu; Shiqin Yang

doi:10.1016/j.scriptamat.2004.03.036

Interface structure and mechanical performance of TLP bonded joints of Al₂O_3p/6061Al composites using Cu/Ni composite interlayers

Jiuchun Yan
, Zhiwu Xu^*
, Gaohui Wu
, Shiqin Yang

^*Corresponding author for this work

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

51 Scopus citations

Abstract

The TLP bonding of Al₂O_3p/6061Al using Cu/Ni/Cu interlayers at 580 °C has been investigated. A pure Ni, Al _0.9Ni_1.1 and Al-based solid solution zone exists in the bond region. The shear strength of joints increases with holding time. The Al_0.9Ni_1.1 zone is the preferential failure source for the bonded joints.

Original language	English
Pages (from-to)	147-150
Number of pages	4
Journal	Scripta Materialia
Volume	51
Issue number	2
DOIs	https://doi.org/10.1016/j.scriptamat.2004.03.036
State	Published - Jul 2004
Externally published	Yes

Keywords

Cu/Ni/Cu interlayers
Diffusion bonding
Fracture
Interface structure
Particulate reinforced composites

Access to Document

10.1016/j.scriptamat.2004.03.036

Cite this

@article{323be9f3b99f42d99e27d38c36fc2848,

title = "Interface structure and mechanical performance of TLP bonded joints of Al2O3p/6061Al composites using Cu/Ni composite interlayers",

abstract = "The TLP bonding of Al2O3p/6061Al using Cu/Ni/Cu interlayers at 580 °C has been investigated. A pure Ni, Al 0.9Ni1.1 and Al-based solid solution zone exists in the bond region. The shear strength of joints increases with holding time. The Al0.9Ni1.1 zone is the preferential failure source for the bonded joints.",

keywords = "Cu/Ni/Cu interlayers, Diffusion bonding, Fracture, Interface structure, Particulate reinforced composites",

author = "Jiuchun Yan and Zhiwu Xu and Gaohui Wu and Shiqin Yang",

year = "2004",

month = jul,

doi = "10.1016/j.scriptamat.2004.03.036",

language = "英语",

volume = "51",

pages = "147--150",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Acta Materialia Inc",

number = "2",

}

TY - JOUR

T1 - Interface structure and mechanical performance of TLP bonded joints of Al2O3p/6061Al composites using Cu/Ni composite interlayers

AU - Yan, Jiuchun

AU - Xu, Zhiwu

AU - Wu, Gaohui

AU - Yang, Shiqin

PY - 2004/7

Y1 - 2004/7

N2 - The TLP bonding of Al2O3p/6061Al using Cu/Ni/Cu interlayers at 580 °C has been investigated. A pure Ni, Al 0.9Ni1.1 and Al-based solid solution zone exists in the bond region. The shear strength of joints increases with holding time. The Al0.9Ni1.1 zone is the preferential failure source for the bonded joints.

AB - The TLP bonding of Al2O3p/6061Al using Cu/Ni/Cu interlayers at 580 °C has been investigated. A pure Ni, Al 0.9Ni1.1 and Al-based solid solution zone exists in the bond region. The shear strength of joints increases with holding time. The Al0.9Ni1.1 zone is the preferential failure source for the bonded joints.

KW - Cu/Ni/Cu interlayers

KW - Diffusion bonding

KW - Fracture

KW - Interface structure

KW - Particulate reinforced composites

UR - https://www.scopus.com/pages/publications/2442532575

U2 - 10.1016/j.scriptamat.2004.03.036

DO - 10.1016/j.scriptamat.2004.03.036

M3 - 文章

AN - SCOPUS:2442532575

SN - 1359-6462

VL - 51

SP - 147

EP - 150

JO - Scripta Materialia

JF - Scripta Materialia

IS - 2

ER -

Interface structure and mechanical performance of TLP bonded joints of Al₂O_3p/6061Al composites using Cu/Ni composite interlayers

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this