Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint

Huijie Liu; Jicai Feng; Yiyu Qian; Zhuoran Li

doi:10.1023/A:1006626132693

Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint

Huijie Liu
, Jicai Feng
, Yiyu Qian
, Zhuoran Li

School of Materials Science and Engineering

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

11 Scopus citations

Abstract

The interface structures and formation mechanism of diffusion-bonded SiC/TiAl joints were studied to lay a foundation for the practical use of SiC/TiAl joints. The morphologies, crystal structures and chemical compositions of the formed phases were investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD), and electron probe X-ray microanalysis (EPMA). Back-scattered electron image of the cross-section of the SiC/TiAl joint bonded at 1573 K for 14.4 ks showed that three kinds of reaction layers occurred between SiC and TiAl. The interface structure of diffusion-bonded SiC/TiAl joints is SiC/TiC/(Ti₅Si₃C_x+TiC)/(TiAl+TiAl₂)/TiAl.

Original language	English
Pages (from-to)	1011-1012
Number of pages	2
Journal	Journal of Materials Science Letters
Volume	18
Issue number	13
DOIs	https://doi.org/10.1023/A:1006626132693
State	Published - 1999

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title = "Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint",

abstract = "The interface structures and formation mechanism of diffusion-bonded SiC/TiAl joints were studied to lay a foundation for the practical use of SiC/TiAl joints. The morphologies, crystal structures and chemical compositions of the formed phases were investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD), and electron probe X-ray microanalysis (EPMA). Back-scattered electron image of the cross-section of the SiC/TiAl joint bonded at 1573 K for 14.4 ks showed that three kinds of reaction layers occurred between SiC and TiAl. The interface structure of diffusion-bonded SiC/TiAl joints is SiC/TiC/(Ti5Si3Cx+TiC)/(TiAl+TiAl2)/TiAl.",

author = "Huijie Liu and Jicai Feng and Yiyu Qian and Zhuoran Li",

year = "1999",

doi = "10.1023/A:1006626132693",

language = "英语",

volume = "18",

pages = "1011--1012",

journal = "Journal of Materials Science Letters",

issn = "0261-8028",

publisher = "Chapman \& Hall",

number = "13",

}

TY - JOUR

T1 - Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint

AU - Liu, Huijie

AU - Feng, Jicai

AU - Qian, Yiyu

AU - Li, Zhuoran

PY - 1999

Y1 - 1999

N2 - The interface structures and formation mechanism of diffusion-bonded SiC/TiAl joints were studied to lay a foundation for the practical use of SiC/TiAl joints. The morphologies, crystal structures and chemical compositions of the formed phases were investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD), and electron probe X-ray microanalysis (EPMA). Back-scattered electron image of the cross-section of the SiC/TiAl joint bonded at 1573 K for 14.4 ks showed that three kinds of reaction layers occurred between SiC and TiAl. The interface structure of diffusion-bonded SiC/TiAl joints is SiC/TiC/(Ti5Si3Cx+TiC)/(TiAl+TiAl2)/TiAl.

AB - The interface structures and formation mechanism of diffusion-bonded SiC/TiAl joints were studied to lay a foundation for the practical use of SiC/TiAl joints. The morphologies, crystal structures and chemical compositions of the formed phases were investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD), and electron probe X-ray microanalysis (EPMA). Back-scattered electron image of the cross-section of the SiC/TiAl joint bonded at 1573 K for 14.4 ks showed that three kinds of reaction layers occurred between SiC and TiAl. The interface structure of diffusion-bonded SiC/TiAl joints is SiC/TiC/(Ti5Si3Cx+TiC)/(TiAl+TiAl2)/TiAl.

UR - https://www.scopus.com/pages/publications/0032638118

U2 - 10.1023/A:1006626132693

DO - 10.1023/A:1006626132693

M3 - 文章

AN - SCOPUS:0032638118

SN - 0261-8028

VL - 18

SP - 1011

EP - 1012

JO - Journal of Materials Science Letters

JF - Journal of Materials Science Letters

IS - 13

ER -

Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint

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