@inproceedings{b10360dd7c244b10a1e7babed198cd74,
title = "Integration of mm-wave Antennas on Fan-Out Wafer Level Packaging (FOWLP) for Automotive Radar Applications",
abstract = "The integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications is presented in this paper. The size of the package is 12 x 15 x 0.45 mm3. The package includes seven antenna arrays realized with three redistribution layers (RDL). Three patch antenna arrays are used as transmitting antennas and four patch antenna arrays are used as receiving antennas. The simulation results show that the proposed antenna achieves a 10-dB input impedance bandwidth of 5.5 GHz and a maximal peak realized gain of 9.9 dBi at 77.6 GHz. The angle resolution of the MIMO radar can be improved to 9.6°.",
keywords = "Antenna-in-package (AiP), automotive radar, fan-out wafer level packaging (FOWLP), millimeter wave (mmWave)",
author = "Zihao Chen and Xi Zhu",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2nd IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2019 ; Conference date: 13-11-2019 Through 15-11-2019",
year = "2019",
month = nov,
doi = "10.1109/ICTA48799.2019.9012825",
language = "英语",
series = "2019 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2019 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "168--169",
booktitle = "2019 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2019 - Proceedings",
address = "美国",
}