Integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications

Zihao Chen; Xi Zhu; Leijia Xu

doi:10.1109/APMC46564.2019.9038285

Integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications

Zihao Chen
, Xi Zhu
, Leijia Xu

Harbin Institute of Technology Shenzhen
University of Technology Sydney

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

This paper presents the integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications. The size of the package is 24x24.5x0.3 mm³, Three microstrip grid array antennas are used as transmitting antennas and four patch sub arrays are used as receiving antennas. The antennas are fed by chip signal which is coupled through a slot in the ground plane. The simulation results show maximal peak realized gain of 14.28 dBi and 11.1 dBi for transmitting and receiving antennas, respectively. The angle resolution of the MIMO radar can be improved to 9.6°.

Original language	English
Title of host publication	Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1607-1609
Number of pages	3
ISBN (Electronic)	9781728135175
DOIs	https://doi.org/10.1109/APMC46564.2019.9038285
State	Published - Dec 2019
Externally published	Yes
Event	2019 IEEE Asia-Pacific Microwave Conference, APMC 2019 - Singapore, Singapore Duration: 10 Dec 2019 → 13 Dec 2019

Publication series

Name	Asia-Pacific Microwave Conference Proceedings, APMC
Volume	2019-December

Conference

Conference	2019 IEEE Asia-Pacific Microwave Conference, APMC 2019
Country/Territory	Singapore
City	Singapore
Period	10/12/19 → 13/12/19

Keywords

Antenna-in-package (AiP)
Automotive radar
Fan-out wafer level packaging (FOWLP)
Millimeter wave (mmWave)

Access to Document

10.1109/APMC46564.2019.9038285

Cite this

Chen, Z., Zhu, X., & Xu, L. (2019). Integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications. In Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019 (pp. 1607-1609). Article 9038285 (Asia-Pacific Microwave Conference Proceedings, APMC; Vol. 2019-December). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APMC46564.2019.9038285

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title = "Integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications",

abstract = "This paper presents the integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications. The size of the package is 24x24.5x0.3 mm3, Three microstrip grid array antennas are used as transmitting antennas and four patch sub arrays are used as receiving antennas. The antennas are fed by chip signal which is coupled through a slot in the ground plane. The simulation results show maximal peak realized gain of 14.28 dBi and 11.1 dBi for transmitting and receiving antennas, respectively. The angle resolution of the MIMO radar can be improved to 9.6°.",

keywords = "Antenna-in-package (AiP), Automotive radar, Fan-out wafer level packaging (FOWLP), Millimeter wave (mmWave)",

author = "Zihao Chen and Xi Zhu and Leijia Xu",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019 ; Conference date: 10-12-2019 Through 13-12-2019",

year = "2019",

month = dec,

doi = "10.1109/APMC46564.2019.9038285",

language = "英语",

series = "Asia-Pacific Microwave Conference Proceedings, APMC",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1607--1609",

booktitle = "Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019",

address = "美国",

}

Chen, Z, Zhu, X & Xu, L 2019, Integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications. in Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019., 9038285, Asia-Pacific Microwave Conference Proceedings, APMC, vol. 2019-December, Institute of Electrical and Electronics Engineers Inc., pp. 1607-1609, 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019, Singapore, Singapore, 10/12/19. https://doi.org/10.1109/APMC46564.2019.9038285

Integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications. / Chen, Zihao; Zhu, Xi; Xu, Leijia.
Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 1607-1609 9038285 (Asia-Pacific Microwave Conference Proceedings, APMC; Vol. 2019-December).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications

AU - Chen, Zihao

AU - Zhu, Xi

AU - Xu, Leijia

PY - 2019/12

Y1 - 2019/12

N2 - This paper presents the integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications. The size of the package is 24x24.5x0.3 mm3, Three microstrip grid array antennas are used as transmitting antennas and four patch sub arrays are used as receiving antennas. The antennas are fed by chip signal which is coupled through a slot in the ground plane. The simulation results show maximal peak realized gain of 14.28 dBi and 11.1 dBi for transmitting and receiving antennas, respectively. The angle resolution of the MIMO radar can be improved to 9.6°.

AB - This paper presents the integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications. The size of the package is 24x24.5x0.3 mm3, Three microstrip grid array antennas are used as transmitting antennas and four patch sub arrays are used as receiving antennas. The antennas are fed by chip signal which is coupled through a slot in the ground plane. The simulation results show maximal peak realized gain of 14.28 dBi and 11.1 dBi for transmitting and receiving antennas, respectively. The angle resolution of the MIMO radar can be improved to 9.6°.

KW - Antenna-in-package (AiP)

KW - Automotive radar

KW - Fan-out wafer level packaging (FOWLP)

KW - Millimeter wave (mmWave)

UR - https://www.scopus.com/pages/publications/85082988029

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DO - 10.1109/APMC46564.2019.9038285

M3 - 会议稿件

AN - SCOPUS:85082988029

T3 - Asia-Pacific Microwave Conference Proceedings, APMC

SP - 1607

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BT - Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019

Y2 - 10 December 2019 through 13 December 2019

ER -

Chen Z, Zhu X, Xu L. Integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications. In Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 1607-1609. 9038285. (Asia-Pacific Microwave Conference Proceedings, APMC). doi: 10.1109/APMC46564.2019.9038285

Integration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications

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