Skip to main navigation Skip to search Skip to main content

Influences of In on the Microstructure and Mechanical Properties of Low Silver Ag-Cu-Zn Filler Metal

  • Chaoli Ma
  • , Songbai Xue*
  • , Tao Zhang
  • , Junyi Jiang
  • , Weimin Long
  • , Guanxing Zhang
  • , Qingke Zhang
  • , Peng He
  • *Corresponding author for this work
  • Nanjing University of Aeronautics and Astronautics
  • Jinhua Shuanghuan Brazing Alloys Co., Ltd
  • Zhengzhou Research Institute of Mechanical Engineering

Research output: Contribution to journalArticlepeer-review

Abstract

Novel low silver based filler metals were developed used for brazing brass and 304 stainless steel. The microstructure of the low silver based filler metals was observed by scanning electron microscopy (SEM) and the wettability was also analyzed. The mechanical properties of lap joint were tested. The brass and stainless steel were brazed with flame method. The results indicate that the microstructure of the metal is composed of Cu base solid solution, Ag base solid solution and CuZn compound. In addition decreases the solidus and liquidus temperatures and improves the wettability of the low silver based filler metals. The tensile strength of joints increases with the addition of indium due to the solution strength effect. The joint of brass and 304 stainless steel by 17AgCuZn-1In exhibits good appearance and dense microstructure with no defects, and its performance is comparable with that of the joint brazed with the B25AgCuZnSn filler metal, suggesting a significant Ag-saving effect.

Original languageEnglish
Pages (from-to)2565-2570
Number of pages6
JournalXiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
Volume46
Issue number9
StatePublished - 1 Sep 2017

Keywords

  • Low silver filler metals
  • Mechanical properties
  • Melting temperature
  • Microstructure

Fingerprint

Dive into the research topics of 'Influences of In on the Microstructure and Mechanical Properties of Low Silver Ag-Cu-Zn Filler Metal'. Together they form a unique fingerprint.

Cite this