TY - GEN
T1 - Influence of reinforcements on the electrical resistivity of novel Sn-Ag-Cu composite solder
AU - Nai, S. M.L.
AU - Wei, J.
AU - Gupta, M.
PY - 2008
Y1 - 2008
N2 - In the present study, 2 different composite solder systems were successfully synthesized using powder metallurgy route consisting of: blending, compaction, sintering and extrusion. The Sn-Ag-Cu based composite solders were reinforced with namely, titanium diboride (TiB2) particulates and multi-walled carbon nanotubes (MWCNTs). The extruded materials were then characterized for their electrical resistivity values using the four-point probe setup from Jandel. The electrical resistivity results showed no degradation of electrical performance of the composite solders, except at high volume percentages of TiB2 addition. This signified that with judicious selection of the reinforcement type and the amount of reinforcement addition, these advanced interconnect materials will benefit industries like the microelectronics flip chip assembly and packaging, MEMS systems and NEMS systems.
AB - In the present study, 2 different composite solder systems were successfully synthesized using powder metallurgy route consisting of: blending, compaction, sintering and extrusion. The Sn-Ag-Cu based composite solders were reinforced with namely, titanium diboride (TiB2) particulates and multi-walled carbon nanotubes (MWCNTs). The extruded materials were then characterized for their electrical resistivity values using the four-point probe setup from Jandel. The electrical resistivity results showed no degradation of electrical performance of the composite solders, except at high volume percentages of TiB2 addition. This signified that with judicious selection of the reinforcement type and the amount of reinforcement addition, these advanced interconnect materials will benefit industries like the microelectronics flip chip assembly and packaging, MEMS systems and NEMS systems.
UR - https://www.scopus.com/pages/publications/44149104596
U2 - 10.1115/IMECE2007-41762
DO - 10.1115/IMECE2007-41762
M3 - 会议稿件
AN - SCOPUS:44149104596
SN - 0791842991
SN - 9780791842997
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings
SP - 39
EP - 42
BT - Electronics and Photonics
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME International Mechanical Engineering Congress and Exposition, IMECE 2007
Y2 - 11 November 2007 through 15 November 2007
ER -