Indirect brazing alumina to copper

Wei Fu; Xiaoguo Song; Yixuan Zhao; Guihai Han; Jicai Feng

Indirect brazing alumina to copper

Wei Fu
, Xiaoguo Song^*
, Yixuan Zhao
, Guihai Han
, Jicai Feng

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology Weihai
Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

The alumina ceramics were metallized by Sn0.3Ag0.7Cu-4%Ti under 900 ℃ and held for 30 min. Then the metallized alumina ceramics were brazed to copper at 600 ℃ for 5 min. The microstructure of metallization layer and shear strength and fracture morphology of brazed joints were analyzed by SEM, EDS and XRD et al. The metallization layer had a sound bond to alumina ceramic by the new metallization method, and the indirect brazing alumina to copper was realized. The interfacial microstructure of alumina/Cu joint was Cu/Cu3Sn/Cu6Sn5/Sn(s,s)+Ti6Sn5/alumina. The shear strength of joint is 13.6 MPa. Fracture analysis showed that joint fracture occurred in intermetallic compound layer.

Original language	English
Pages (from-to)	27-30
Number of pages	4
Journal	Hanjie Xuebao/Transactions of the China Welding Institution
Volume	36
Issue number	6
State	Published - 25 Jun 2015

Keywords

Active element
Alumina
Indirect brazing
Lead-free solder
Metallization

Cite this

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title = "Indirect brazing alumina to copper",

abstract = "The alumina ceramics were metallized by Sn0.3Ag0.7Cu-4\%Ti under 900 ℃ and held for 30 min. Then the metallized alumina ceramics were brazed to copper at 600 ℃ for 5 min. The microstructure of metallization layer and shear strength and fracture morphology of brazed joints were analyzed by SEM, EDS and XRD et al. The metallization layer had a sound bond to alumina ceramic by the new metallization method, and the indirect brazing alumina to copper was realized. The interfacial microstructure of alumina/Cu joint was Cu/Cu3Sn/Cu6Sn5/Sn(s,s)+Ti6Sn5/alumina. The shear strength of joint is 13.6 MPa. Fracture analysis showed that joint fracture occurred in intermetallic compound layer.",

keywords = "Active element, Alumina, Indirect brazing, Lead-free solder, Metallization",

author = "Wei Fu and Xiaoguo Song and Yixuan Zhao and Guihai Han and Jicai Feng",

year = "2015",

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day = "25",

language = "英语",

volume = "36",

pages = "27--30",

journal = "Hanjie Xuebao/Transactions of the China Welding Institution",

issn = "0253-360X",

publisher = "Harbin Research Institute of Welding",

number = "6",

}

TY - JOUR

T1 - Indirect brazing alumina to copper

AU - Fu, Wei

AU - Song, Xiaoguo

AU - Zhao, Yixuan

AU - Han, Guihai

AU - Feng, Jicai

PY - 2015/6/25

Y1 - 2015/6/25

N2 - The alumina ceramics were metallized by Sn0.3Ag0.7Cu-4%Ti under 900 ℃ and held for 30 min. Then the metallized alumina ceramics were brazed to copper at 600 ℃ for 5 min. The microstructure of metallization layer and shear strength and fracture morphology of brazed joints were analyzed by SEM, EDS and XRD et al. The metallization layer had a sound bond to alumina ceramic by the new metallization method, and the indirect brazing alumina to copper was realized. The interfacial microstructure of alumina/Cu joint was Cu/Cu3Sn/Cu6Sn5/Sn(s,s)+Ti6Sn5/alumina. The shear strength of joint is 13.6 MPa. Fracture analysis showed that joint fracture occurred in intermetallic compound layer.

AB - The alumina ceramics were metallized by Sn0.3Ag0.7Cu-4%Ti under 900 ℃ and held for 30 min. Then the metallized alumina ceramics were brazed to copper at 600 ℃ for 5 min. The microstructure of metallization layer and shear strength and fracture morphology of brazed joints were analyzed by SEM, EDS and XRD et al. The metallization layer had a sound bond to alumina ceramic by the new metallization method, and the indirect brazing alumina to copper was realized. The interfacial microstructure of alumina/Cu joint was Cu/Cu3Sn/Cu6Sn5/Sn(s,s)+Ti6Sn5/alumina. The shear strength of joint is 13.6 MPa. Fracture analysis showed that joint fracture occurred in intermetallic compound layer.

KW - Active element

KW - Alumina

KW - Indirect brazing

KW - Lead-free solder

KW - Metallization

UR - https://www.scopus.com/pages/publications/84936931753

M3 - 文章

AN - SCOPUS:84936931753

SN - 0253-360X

VL - 36

SP - 27

EP - 30

JO - Hanjie Xuebao/Transactions of the China Welding Institution

JF - Hanjie Xuebao/Transactions of the China Welding Institution

IS - 6

ER -

Indirect brazing alumina to copper

Abstract

Keywords

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