In situ TEM observation of microcrack nucleation and propagation in pure tin solder

Ying Ding; Chunqing Wang; Mingyu Li; Weiqiang Wang

doi:10.1016/j.mseb.2005.09.050

In situ TEM observation of microcrack nucleation and propagation in pure tin solder

Ying Ding^*
, Chunqing Wang
, Mingyu Li
, Weiqiang Wang

^*Corresponding author for this work

Harbin Institute of Technology
University Town of Shenzhen

Research output: Contribution to journal › Article › peer-review

17 Scopus citations

Abstract

Microcrack nucleation and propagation behavior in pure tin solder was investigated by using transmission electron microscopy (TEM) through in situ tensile test. Observation results showed that fracture process was completed in this visco-plastic material by connecting discontinuous cracks or voids. Depending on remarkable vacancy diffusion ability, microvoids were nucleated and developed in the dislocation free zone (DFZ) or super thinned area ahead of crack tip under local high stress concentration. The cracks were linked with each other by mutual dislocation emission which expedites the propagation of crack tips effectively.

Original language	English
Pages (from-to)	62-69
Number of pages	8
Journal	Materials Science and Engineering: B
Volume	127
Issue number	1
DOIs	https://doi.org/10.1016/j.mseb.2005.09.050
State	Published - 15 Feb 2006
Externally published	Yes

Keywords

Crack nucleation
Crack propagation
In situ TEM
Pure tin solder

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10.1016/j.mseb.2005.09.050

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title = "In situ TEM observation of microcrack nucleation and propagation in pure tin solder",

abstract = "Microcrack nucleation and propagation behavior in pure tin solder was investigated by using transmission electron microscopy (TEM) through in situ tensile test. Observation results showed that fracture process was completed in this visco-plastic material by connecting discontinuous cracks or voids. Depending on remarkable vacancy diffusion ability, microvoids were nucleated and developed in the dislocation free zone (DFZ) or super thinned area ahead of crack tip under local high stress concentration. The cracks were linked with each other by mutual dislocation emission which expedites the propagation of crack tips effectively.",

keywords = "Crack nucleation, Crack propagation, In situ TEM, Pure tin solder",

author = "Ying Ding and Chunqing Wang and Mingyu Li and Weiqiang Wang",

year = "2006",

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T1 - In situ TEM observation of microcrack nucleation and propagation in pure tin solder

AU - Ding, Ying

AU - Wang, Chunqing

AU - Li, Mingyu

AU - Wang, Weiqiang

PY - 2006/2/15

Y1 - 2006/2/15

N2 - Microcrack nucleation and propagation behavior in pure tin solder was investigated by using transmission electron microscopy (TEM) through in situ tensile test. Observation results showed that fracture process was completed in this visco-plastic material by connecting discontinuous cracks or voids. Depending on remarkable vacancy diffusion ability, microvoids were nucleated and developed in the dislocation free zone (DFZ) or super thinned area ahead of crack tip under local high stress concentration. The cracks were linked with each other by mutual dislocation emission which expedites the propagation of crack tips effectively.

AB - Microcrack nucleation and propagation behavior in pure tin solder was investigated by using transmission electron microscopy (TEM) through in situ tensile test. Observation results showed that fracture process was completed in this visco-plastic material by connecting discontinuous cracks or voids. Depending on remarkable vacancy diffusion ability, microvoids were nucleated and developed in the dislocation free zone (DFZ) or super thinned area ahead of crack tip under local high stress concentration. The cracks were linked with each other by mutual dislocation emission which expedites the propagation of crack tips effectively.

KW - Crack nucleation

KW - Crack propagation

KW - In situ TEM

KW - Pure tin solder

UR - https://www.scopus.com/pages/publications/30844439636

U2 - 10.1016/j.mseb.2005.09.050

DO - 10.1016/j.mseb.2005.09.050

M3 - 文章

AN - SCOPUS:30844439636

SN - 0921-5107

VL - 127

SP - 62

EP - 69

JO - Materials Science and Engineering: B

JF - Materials Science and Engineering: B

IS - 1

ER -

In situ TEM observation of microcrack nucleation and propagation in pure tin solder

Abstract

Keywords

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