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Improvement in compressive creep resistance of Ti-43.5Al–4Nb–1Mo-0.1B alloy via micro-alloying with C and Si

  • Zhenquan Liang
  • , Shulong Xiao*
  • , Hongbao Yu*
  • , Dazhao Chi*
  • , Qingchao Li
  • , Yunfei Zheng
  • , Lijuan Xu*
  • , Xiang Xue
  • , Jing Tian
  • , Yuyong Chen
  • *Corresponding author for this work
  • Harbin Institute of Technology
  • Harbin Institute of Technology
  • Guilin University of Electronic Technology

Research output: Contribution to journalArticlepeer-review

Abstract

In the present work, the effects of the addition of C and Si on the compressive creep behavior of Ti-43.5Al–4Nb–1Mo-0.1B (TNM) alloy at 850 °C and 900 °C under 260 MPa were investigated. The results show that micro-alloying with C and Si can significantly strengthen the compressive creep resistance of TNM alloy. During compressive creep, obvious dynamic recrystallization occurs in TNM alloy, including major discontinuous dynamic recrystallization and minor continuous dynamic recrystallization. The development of dynamic recrystallization greatly softens the alloy, which leads to large creep deformation. Meanwhile, with the increase of creep strain, the bearing area increases and the actual stress decreases, which eventually results in the secondary creep behavior. In addition, the content of α2 phase increases during compressive creep, which can be attributed to two phase transformations. After adding C and Si, the B2 phase content is decreased and the lamellar colony size is increased, which contributes to the improvement of creep resistance. In addition, fine and dispersed Ti3AlC and Ti5Si3 particles precipitate in α2 lamellae during compressive creep, and maintain definite orientation relationships with α2 and γ phases. This will delay the decomposition of α2 lamellae and greatly improve the lamellar stability. Then, the excellent lamellar stability will inhibit the development of dynamic recrystallization, thus effectively reducing the creep rate.

Original languageEnglish
Article number145813
JournalMaterials Science and Engineering: A
Volume888
DOIs
StatePublished - 17 Nov 2023

Keywords

  • C and Si
  • Compressive creep
  • Dynamic recrystallization
  • TiAl alloy

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