Improved performance of diode-end-pumped Nd:GdVO₄ 912 nm laser property with indium solder technology

A novel indium-solder technology is demonstrated to deal with the serious thermal dissipation problem in the 912 nm Nd:GdVO₄ laser operation. By use of indium-solder between the laser rod and the heat-sink, the contact resistance is reduced by removing the air bubble and heat conducting silicon and the boundary heat transfer coefficient is raised. After the indium-solder was used, it is found that the temperature in the laser rod and the deformation in the pumping end surface are eased remarkably based on a simulation of finite element analysis. Experimental results show that the continuous-wave 912 nm laser performance is improved obviously, both in a plano-plano cavity and a plano-concave cavity.