TY - GEN
T1 - Improved modeling for solder joint geometry and self-alignment in flip chip bonding
AU - Wang, Chenxi
AU - Wang, Chunqing
PY - 2010
Y1 - 2010
N2 - Prediction of solder joint geometry is one of key steps for achieving accurate alignment in optoelectronic packaging. An improved modeling is developed to predict the solder joint geometry. The wetting angle of molten solder in pad as well as that out of pad is taken into account in this model. Therefore, the molten solder geometry overflowed pads can be successfully predicted. The simulation result is corroborated by our experimental tests. This method is also applied for modeling of multiple solder joints. Moreover, the restore force of the misaligned solder joint, determined by various parameters, could be calculated in the self-alignment process based on the above-mentioned model. In addition, a polynomial regression model is accomplished to clearly understand the relationships between the restore force and the parameters of solder joints. And the alignment accuracy is expected to be improved thanks to optimization of solder joint geometry and restore force.
AB - Prediction of solder joint geometry is one of key steps for achieving accurate alignment in optoelectronic packaging. An improved modeling is developed to predict the solder joint geometry. The wetting angle of molten solder in pad as well as that out of pad is taken into account in this model. Therefore, the molten solder geometry overflowed pads can be successfully predicted. The simulation result is corroborated by our experimental tests. This method is also applied for modeling of multiple solder joints. Moreover, the restore force of the misaligned solder joint, determined by various parameters, could be calculated in the self-alignment process based on the above-mentioned model. In addition, a polynomial regression model is accomplished to clearly understand the relationships between the restore force and the parameters of solder joints. And the alignment accuracy is expected to be improved thanks to optimization of solder joint geometry and restore force.
UR - https://www.scopus.com/pages/publications/78449296766
U2 - 10.1109/ICEPT.2010.5582837
DO - 10.1109/ICEPT.2010.5582837
M3 - 会议稿件
AN - SCOPUS:78449296766
SN - 9781424481422
T3 - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
SP - 747
EP - 752
BT - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
T2 - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Y2 - 16 August 2010 through 19 August 2010
ER -