Abstract
Based on the equivalent impedance for the individual part of transducer used in the ultrasonic flip chip bonding, an impedance model of transducer system in the working condition has been established by the equivalent circuit method. The impedance model has been calculated numerically and the impedance property has been verified by the frequency sweeping measurement. It has been found that there were four axial vibration modes of transducer system in 100 kHz. Comparing with the non-working condition, each resonance frequency and its impedance increased while the conductance value decreased when the transducer was in working condition. The results of experiment measurement well agreed well with the impedance model.
| Original language | English |
|---|---|
| Pages (from-to) | 1062-1065 |
| Number of pages | 4 |
| Journal | Yadian Yu Shengguang/Piezoelectrics and Acoustooptics |
| Volume | 32 |
| Issue number | 6 |
| State | Published - Dec 2010 |
| Externally published | Yes |
Keywords
- Equivalent circuit model
- Flip chip ultrasonic transducer
- Impedance/admittance
- Working condition
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