Image preprocessing of solder joints by X-ray

Ji Quan Ma; Pei Jun Ma; Xiao Hong Su

Image preprocessing of solder joints by X-ray

Ji Quan Ma^*
, Pei Jun Ma
, Xiao Hong Su

^*Corresponding author for this work

Faculty of Computing

Harbin Institute of Technology
Heilongjiang University

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

To inspect the array solder joints hidden under IC package in ball grid array (BGA) mounting technology, X-ray was used to obtain the image. This paper discusses the flow and theory of detecting defects based on the X-ray imaging and focuses on the image preprocessing of solder joints. To increase the efficiency, a new method for threshold getting is introduced. And the criterion for the quality of solder joints is discussed. Experimental results reveal that the proposed method is feasible in BGA solder joint inspection.

Original language	English
Pages (from-to)	397-400
Number of pages	4
Journal	Harbin Gongye Daxue Xuebao/Journal of Harbin Institute of Technology
Volume	40
Issue number	3
State	Published - Mar 2008

Keywords

Ball grid array
Inspection
Segmentation
Solder joints

Cite this

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title = "Image preprocessing of solder joints by X-ray",

abstract = "To inspect the array solder joints hidden under IC package in ball grid array (BGA) mounting technology, X-ray was used to obtain the image. This paper discusses the flow and theory of detecting defects based on the X-ray imaging and focuses on the image preprocessing of solder joints. To increase the efficiency, a new method for threshold getting is introduced. And the criterion for the quality of solder joints is discussed. Experimental results reveal that the proposed method is feasible in BGA solder joint inspection.",

keywords = "Ball grid array, Inspection, Segmentation, Solder joints",

author = "Ma, \{Ji Quan\} and Ma, \{Pei Jun\} and Su, \{Xiao Hong\}",

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AU - Ma, Pei Jun

AU - Su, Xiao Hong

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N2 - To inspect the array solder joints hidden under IC package in ball grid array (BGA) mounting technology, X-ray was used to obtain the image. This paper discusses the flow and theory of detecting defects based on the X-ray imaging and focuses on the image preprocessing of solder joints. To increase the efficiency, a new method for threshold getting is introduced. And the criterion for the quality of solder joints is discussed. Experimental results reveal that the proposed method is feasible in BGA solder joint inspection.

AB - To inspect the array solder joints hidden under IC package in ball grid array (BGA) mounting technology, X-ray was used to obtain the image. This paper discusses the flow and theory of detecting defects based on the X-ray imaging and focuses on the image preprocessing of solder joints. To increase the efficiency, a new method for threshold getting is introduced. And the criterion for the quality of solder joints is discussed. Experimental results reveal that the proposed method is feasible in BGA solder joint inspection.

KW - Ball grid array

KW - Inspection

KW - Segmentation

KW - Solder joints

UR - https://www.scopus.com/pages/publications/43749113777

M3 - 文章

AN - SCOPUS:43749113777

SN - 0367-6234

VL - 40

SP - 397

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JO - Harbin Gongye Daxue Xuebao/Journal of Harbin Institute of Technology

JF - Harbin Gongye Daxue Xuebao/Journal of Harbin Institute of Technology

IS - 3

ER -

Image preprocessing of solder joints by X-ray

Abstract

Keywords

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