TY - GEN
T1 - Hybrid flexible smart temperature tag with NFC technology for smart packaging
AU - Zhang, Xi
AU - Shan, Xuechuan
AU - Wei, Jun
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/2
Y1 - 2017/7/2
N2 - Flexible hybrid electronics is one of the key technology that enables to combine the benefits of printed electronics with that of modern silicon electronics. In this work, a prototype of hybrid flexible smart temperature tag is proposed for environmental temperature monitoring. The tag is designed with sensing and processing capabilities as well as NFC (near field communication) compatibility. It can be used for potential temperature-sensitive products management and smart packaging; thus not only the end-users/consumers who concern about the quality issues of the products can be benefit, but also the manufactures/distributors can make use of this tag into the temperature-controlled supply chain management and tracking system for various temperature-sensitive products and applications, such as bio-medical & pharmaceutical products, high-class foods and beverages, etc.
AB - Flexible hybrid electronics is one of the key technology that enables to combine the benefits of printed electronics with that of modern silicon electronics. In this work, a prototype of hybrid flexible smart temperature tag is proposed for environmental temperature monitoring. The tag is designed with sensing and processing capabilities as well as NFC (near field communication) compatibility. It can be used for potential temperature-sensitive products management and smart packaging; thus not only the end-users/consumers who concern about the quality issues of the products can be benefit, but also the manufactures/distributors can make use of this tag into the temperature-controlled supply chain management and tracking system for various temperature-sensitive products and applications, such as bio-medical & pharmaceutical products, high-class foods and beverages, etc.
UR - https://www.scopus.com/pages/publications/85050631469
U2 - 10.1109/EPTC.2017.8277578
DO - 10.1109/EPTC.2017.8277578
M3 - 会议稿件
AN - SCOPUS:85050631469
T3 - 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
SP - 1
EP - 5
BT - 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017
Y2 - 6 December 2017 through 9 December 2017
ER -