High-performance interconnects for high-temperature resistance measurement toward on-line health monitoring of C_f/SiC composites

In response to the demands for the intelligent thermal structure of aircraft, on-line health monitoring based on high-temperature resistance measurement of ceramic matrix composites (CMCs) can effectively identify the damage state of CMCs. However, highly reliable interconnects between CMCs and metal electrodes remain a major challenge, requiring high temperature resistance, high interface strength and excellent electrical stability. High-performance interconnects were realized by the diffusion reaction of a novel hybrid solder (polysilazane and Ag-Cu-Ti) between Mo electrodes and C_f/SiC composites. Highly conductive and temperature resistant Ti(C,N) and (Ti,Mo)₅Si₃ were formed on the C_f/SiC and Mo electrode side respectively, and a mixed metal/ ceramic structure Ag(C)/Cu/Ti(C,N) were formed in the hybrid solder matrix. The high-performance interconnects exhibit high interface strength of 14.97–19.07 MPa. The resistance measurement can be conducted stably up to 1200 ℃ in an argon atmosphere and 825 ℃ in air with excellent resistance stability and repeatability.