High Gain Inductive Power Transfer System Design Based on the S/SP Topology

Jinhao Chen; Jiantao Zhang; Yong Li; Chunbo Zhu

doi:10.1109/CIEEC54735.2022.9846344

High Gain Inductive Power Transfer System Design Based on the S/SP Topology

Jinhao Chen^*
, Jiantao Zhang
, Yong Li
, Chunbo Zhu

^*Corresponding author for this work

School of Electrical Engineering and Automation

Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Recently, the requests for high gain wireless power systems are increasing rapidly in the new material and renewable resource field. The high voltage gain is still challenging in the wireless power transfer research. This paper presents a high voltage gain inductive power transfer system design method using the S/SP topology. The misalignment effect on voltage gain and the ZVS state achievement is considered. To reduce the system weight and volume, the PCB coil is used to design the prototype system. Experiments have shown that the designed prototype can provide a high voltage gain with the anti-misalignment ability and light-weight feature.

Original language	English
Title of host publication	Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1918-1923
Number of pages	6
ISBN (Electronic)	9781665411042
DOIs	https://doi.org/10.1109/CIEEC54735.2022.9846344
State	Published - 2022
Event	5th IEEE International Electrical and Energy Conference, CIEEC 2022 - Nanjing, China Duration: 27 May 2022 → 29 May 2022

Publication series

Name	Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022

Conference

Conference	5th IEEE International Electrical and Energy Conference, CIEEC 2022
Country/Territory	China
City	Nanjing
Period	27/05/22 → 29/05/22

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy

Keywords

PCB coil
S/SP compensating topology
Wireless power transfer
misalignment optimization

Access to Document

10.1109/CIEEC54735.2022.9846344

Cite this

Chen, J., Zhang, J., Li, Y., & Zhu, C. (2022). High Gain Inductive Power Transfer System Design Based on the S/SP Topology. In Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022 (pp. 1918-1923). (Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CIEEC54735.2022.9846344

Chen, Jinhao ; Zhang, Jiantao ; Li, Yong et al. / High Gain Inductive Power Transfer System Design Based on the S/SP Topology. Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022. Institute of Electrical and Electronics Engineers Inc., 2022. pp. 1918-1923 (Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022).

@inproceedings{79b78b6e8ab34c70926852ad039e692e,

title = "High Gain Inductive Power Transfer System Design Based on the S/SP Topology",

abstract = "Recently, the requests for high gain wireless power systems are increasing rapidly in the new material and renewable resource field. The high voltage gain is still challenging in the wireless power transfer research. This paper presents a high voltage gain inductive power transfer system design method using the S/SP topology. The misalignment effect on voltage gain and the ZVS state achievement is considered. To reduce the system weight and volume, the PCB coil is used to design the prototype system. Experiments have shown that the designed prototype can provide a high voltage gain with the anti-misalignment ability and light-weight feature.",

keywords = "PCB coil, S/SP compensating topology, Wireless power transfer, misalignment optimization",

author = "Jinhao Chen and Jiantao Zhang and Yong Li and Chunbo Zhu",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 5th IEEE International Electrical and Energy Conference, CIEEC 2022 ; Conference date: 27-05-2022 Through 29-05-2022",

year = "2022",

doi = "10.1109/CIEEC54735.2022.9846344",

language = "英语",

series = "Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1918--1923",

booktitle = "Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022",

address = "美国",

}

Chen, J, Zhang, J , Li, Y & Zhu, C 2022, High Gain Inductive Power Transfer System Design Based on the S/SP Topology. in Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022. Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022, Institute of Electrical and Electronics Engineers Inc., pp. 1918-1923, 5th IEEE International Electrical and Energy Conference, CIEEC 2022, Nanjing, China, 27/05/22. https://doi.org/10.1109/CIEEC54735.2022.9846344

High Gain Inductive Power Transfer System Design Based on the S/SP Topology. / Chen, Jinhao; Zhang, Jiantao ; Li, Yong et al.
Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022. Institute of Electrical and Electronics Engineers Inc., 2022. p. 1918-1923 (Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - High Gain Inductive Power Transfer System Design Based on the S/SP Topology

AU - Chen, Jinhao

AU - Zhang, Jiantao

AU - Li, Yong

AU - Zhu, Chunbo

PY - 2022

Y1 - 2022

N2 - Recently, the requests for high gain wireless power systems are increasing rapidly in the new material and renewable resource field. The high voltage gain is still challenging in the wireless power transfer research. This paper presents a high voltage gain inductive power transfer system design method using the S/SP topology. The misalignment effect on voltage gain and the ZVS state achievement is considered. To reduce the system weight and volume, the PCB coil is used to design the prototype system. Experiments have shown that the designed prototype can provide a high voltage gain with the anti-misalignment ability and light-weight feature.

AB - Recently, the requests for high gain wireless power systems are increasing rapidly in the new material and renewable resource field. The high voltage gain is still challenging in the wireless power transfer research. This paper presents a high voltage gain inductive power transfer system design method using the S/SP topology. The misalignment effect on voltage gain and the ZVS state achievement is considered. To reduce the system weight and volume, the PCB coil is used to design the prototype system. Experiments have shown that the designed prototype can provide a high voltage gain with the anti-misalignment ability and light-weight feature.

KW - PCB coil

KW - S/SP compensating topology

KW - Wireless power transfer

KW - misalignment optimization

UR - https://www.scopus.com/pages/publications/85137369429

U2 - 10.1109/CIEEC54735.2022.9846344

DO - 10.1109/CIEEC54735.2022.9846344

M3 - 会议稿件

AN - SCOPUS:85137369429

T3 - Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022

SP - 1918

EP - 1923

BT - Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 5th IEEE International Electrical and Energy Conference, CIEEC 2022

Y2 - 27 May 2022 through 29 May 2022

ER -

Chen J, Zhang J , Li Y , Zhu C. High Gain Inductive Power Transfer System Design Based on the S/SP Topology. In Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022. Institute of Electrical and Electronics Engineers Inc. 2022. p. 1918-1923. (Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022). doi: 10.1109/CIEEC54735.2022.9846344

High Gain Inductive Power Transfer System Design Based on the S/SP Topology

Abstract

Publication series

Conference

UN SDGs

Keywords

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