@inproceedings{9b8bbe0991d9438fad67499a9e279fb1,
title = "High Density TSV-Free Interposer (TFI) packaging with submicron Cu Damascene RDLs for Integration of CPU/GPU and HBM",
abstract = "TSV-Free Interposer (TFI) packaging technology was developed for central/graphics processing unit (CPU/GPU) and stacked memory system-in-package (SiP) applications. TFI package is targeting to accommodate thick module as High Bandwidth Memory (HBM) and wide-bus interconnections between CPU/GPU and HBM in a package with cost-effective process. The redistribution layer structure was studied based on inter-chip connectivity between CPU/GPU and HBM as well as signal integrity and power integrity. This study demonstrated capability of TFI package in view of electrical performance, cost effectiveness and process challenges. The process challenges were overcome by co-design modeling and process optimizations.",
keywords = "Cu damascene, FOWLP, Fan-out wafer-level packaging, RDL-first, TFI, TSV-free interposer",
author = "Masaya Kawano and Wang, \{Chum Mei\} and Li, \{Hong Yu\} and Ding, \{Mian Zhi\} and Lim, \{Sharon Pei Siang\} and Lim, \{Teck Guan\} and Chen, \{Zi Hao\} and Che, \{Fa Xing\}",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 68th IEEE Electronic Components and Technology Conference, ECTC 2018 ; Conference date: 29-05-2018 Through 01-06-2018",
year = "2018",
month = aug,
day = "7",
doi = "10.1109/ECTC.2018.00282",
language = "英语",
isbn = "9781538649985",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1885--1892",
booktitle = "Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018",
address = "美国",
}