Heat transfer analyses of molten droplet solder bumping for electronic interconnection

Fuquan Li; Chunqing Wang; Zhenqing Zhao; Peter Liu; Deming Liu

Heat transfer analyses of molten droplet solder bumping for electronic interconnection

Fuquan Li^*
, Chunqing Wang
, Zhenqing Zhao
, Peter Liu
, Deming Liu

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology
ASM Assembly Automation Ltd.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Molten droplet solder bumping as a new type bumping method is developed in recent years. In this paper, the basic process and phenomenon of this method was investigated. The interfacial reaction between 63Sn37Pb droplet and Au\Ni\Cu pad was analyzed by SEM, that morphology of intermetallic compounds at interface is strongly influenced by initial temperature of solder ball. Results of the have shown: initial temperature of solder ball was the main factor for bump fabrication. The pad temperature field was analyzed using finite element method (FEM).

Original language	English
Title of host publication	Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04
Pages	336-340
Number of pages	5
State	Published - 2004
Event	Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04 - Shanghai, China Duration: 30 Jun 2004 → 3 Jul 2004

Publication series

Name	Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

Conference

Conference	Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04
Country/Territory	China
City	Shanghai
Period	30/06/04 → 3/07/04

Keywords

Contact temperature
Droplet
FEM
Intermetallic
Solder

Cite this

Li, F., Wang, C., Zhao, Z., Liu, P., & Liu, D. (2004). Heat transfer analyses of molten droplet solder bumping for electronic interconnection. In Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04 (pp. 336-340). (Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04).

Li, Fuquan ; Wang, Chunqing ; Zhao, Zhenqing et al. / Heat transfer analyses of molten droplet solder bumping for electronic interconnection. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04. 2004. pp. 336-340 (Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04).

@inproceedings{e1b8abe26a7c4cb58d0b7faeeaf6ef66,

title = "Heat transfer analyses of molten droplet solder bumping for electronic interconnection",

abstract = "Molten droplet solder bumping as a new type bumping method is developed in recent years. In this paper, the basic process and phenomenon of this method was investigated. The interfacial reaction between 63Sn37Pb droplet and Au\textbackslash{}Ni\textbackslash{}Cu pad was analyzed by SEM, that morphology of intermetallic compounds at interface is strongly influenced by initial temperature of solder ball. Results of the have shown: initial temperature of solder ball was the main factor for bump fabrication. The pad temperature field was analyzed using finite element method (FEM).",

keywords = "Contact temperature, Droplet, FEM, Intermetallic, Solder",

author = "Fuquan Li and Chunqing Wang and Zhenqing Zhao and Peter Liu and Deming Liu",

year = "2004",

language = "英语",

isbn = "0780386205",

series = "Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04",

pages = "336--340",

booktitle = "Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04",

note = "Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04 ; Conference date: 30-06-2004 Through 03-07-2004",

}

Li, F, Wang, C, Zhao, Z, Liu, P & Liu, D 2004, Heat transfer analyses of molten droplet solder bumping for electronic interconnection. in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04, pp. 336-340, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04, Shanghai, China, 30/06/04.

Heat transfer analyses of molten droplet solder bumping for electronic interconnection. / Li, Fuquan; Wang, Chunqing; Zhao, Zhenqing et al.
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04. 2004. p. 336-340 (Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Heat transfer analyses of molten droplet solder bumping for electronic interconnection

AU - Li, Fuquan

AU - Wang, Chunqing

AU - Zhao, Zhenqing

AU - Liu, Peter

AU - Liu, Deming

PY - 2004

Y1 - 2004

N2 - Molten droplet solder bumping as a new type bumping method is developed in recent years. In this paper, the basic process and phenomenon of this method was investigated. The interfacial reaction between 63Sn37Pb droplet and Au\Ni\Cu pad was analyzed by SEM, that morphology of intermetallic compounds at interface is strongly influenced by initial temperature of solder ball. Results of the have shown: initial temperature of solder ball was the main factor for bump fabrication. The pad temperature field was analyzed using finite element method (FEM).

AB - Molten droplet solder bumping as a new type bumping method is developed in recent years. In this paper, the basic process and phenomenon of this method was investigated. The interfacial reaction between 63Sn37Pb droplet and Au\Ni\Cu pad was analyzed by SEM, that morphology of intermetallic compounds at interface is strongly influenced by initial temperature of solder ball. Results of the have shown: initial temperature of solder ball was the main factor for bump fabrication. The pad temperature field was analyzed using finite element method (FEM).

KW - Contact temperature

KW - Droplet

KW - FEM

KW - Intermetallic

KW - Solder

UR - https://www.scopus.com/pages/publications/14844311996

M3 - 会议稿件

AN - SCOPUS:14844311996

SN - 0780386205

T3 - Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

SP - 336

EP - 340

BT - Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

T2 - Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

Y2 - 30 June 2004 through 3 July 2004

ER -

Li F, Wang C, Zhao Z, Liu P, Liu D. Heat transfer analyses of molten droplet solder bumping for electronic interconnection. In Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04. 2004. p. 336-340. (Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04).

Heat transfer analyses of molten droplet solder bumping for electronic interconnection

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