Guest editorial: 24th international conference on electronic packaging technology

Shuye Zhang; Qidong Wang; Mingliang Huang; Kyung W. Paik

doi:10.1108/SSMT-03-2025-080

Guest editorial: 24th international conference on electronic packaging technology

Shuye Zhang
, Qidong Wang
, Mingliang Huang
, Kyung W. Paik

School of Materials Science and Engineering

CAS - Institute of Microelectronics
Dalian University of Technology
Korea Advanced Institute of Science and Technology

Research output: Contribution to journal › Editorial

Original language	English
Pages (from-to)	85
Number of pages	1
Journal	Soldering and Surface Mount Technology
Volume	37
Issue number	2
DOIs	https://doi.org/10.1108/SSMT-03-2025-080
State	Published - 19 Mar 2025

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title = "Guest editorial: 24th international conference on electronic packaging technology",

author = "Shuye Zhang and Qidong Wang and Mingliang Huang and Paik, \{Kyung W.\}",

year = "2025",

month = mar,

day = "19",

doi = "10.1108/SSMT-03-2025-080",

language = "英语",

volume = "37",

pages = "85",

journal = "Soldering and Surface Mount Technology",

issn = "0954-0911",

publisher = "Emerald Publishing",

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T1 - Guest editorial

T2 - 24th international conference on electronic packaging technology

AU - Zhang, Shuye

AU - Wang, Qidong

AU - Huang, Mingliang

AU - Paik, Kyung W.

PY - 2025/3/19

Y1 - 2025/3/19

UR - https://www.scopus.com/pages/publications/105001249625

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DO - 10.1108/SSMT-03-2025-080

M3 - 社论

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SN - 0954-0911

VL - 37

SP - 85

JO - Soldering and Surface Mount Technology

JF - Soldering and Surface Mount Technology

IS - 2

ER -

Guest editorial: 24th international conference on electronic packaging technology

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