Growth mechanism of Cu-Sn full IMC joints on polycrystalline and single crystal Cu substrate

Rui Zhang; Yanhong Tian; Baolei Liu; Chunjin Hang

doi:10.1109/ICEPT.2013.6756690

Growth mechanism of Cu-Sn full IMC joints on polycrystalline and single crystal Cu substrate

Rui Zhang
, Yanhong Tian^*
, Baolei Liu
, Chunjin Hang

^*Corresponding author for this work

Harbin Institute of Technology

Research output: Contribution to conference › Paper › peer-review

3 Scopus citations

Abstract

Growth mechanisms of Cu-Sn IMC joints bonded at 300°C on polycrystalline and single crystal Cu substrates were investigated by Scanning Electron Microscopy (SEM) and Electron Backscatter Diffraction (EBSD) technology. The results showed that the prism-type Cu₆Sn₅ grains formed on single crystal Cu substrate in the initial stage grew into the scallop-type Cu₆Sn₅ grains by grain rotation and merge mechanism with the proceeding of the bonding. In addition, the scallop-type Cu₆Sn₅ grains didn't have preferred orientation. The columnar Cu₃Sn grains grew in clusters at the expense of Cu ₆Sn₅ along direction of the adjacent Cu₆Sn ₅ grains grain boundaries. The orientation of Cu₃Sn was unrelated to that of Cu or Cu₆Sn₅, but had preferred orientations of Cu₃Sn (100) parallel to the Cu substrate.

Original language	English
Pages	1276-1279
Number of pages	4
DOIs	https://doi.org/10.1109/ICEPT.2013.6756690
State	Published - 2013
Externally published	Yes
Event	2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013 - Dalian, China Duration: 11 Aug 2013 → 14 Aug 2013

Conference

Conference	2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013
Country/Territory	China
City	Dalian
Period	11/08/13 → 14/08/13

Keywords

Cu single crystal
EBSD
Growth mechanisms
Intermetallic compound joint
Orientation

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10.1109/ICEPT.2013.6756690

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title = "Growth mechanism of Cu-Sn full IMC joints on polycrystalline and single crystal Cu substrate",

abstract = "Growth mechanisms of Cu-Sn IMC joints bonded at 300°C on polycrystalline and single crystal Cu substrates were investigated by Scanning Electron Microscopy (SEM) and Electron Backscatter Diffraction (EBSD) technology. The results showed that the prism-type Cu6Sn5 grains formed on single crystal Cu substrate in the initial stage grew into the scallop-type Cu6Sn5 grains by grain rotation and merge mechanism with the proceeding of the bonding. In addition, the scallop-type Cu6Sn5 grains didn't have preferred orientation. The columnar Cu3Sn grains grew in clusters at the expense of Cu 6Sn5 along direction of the adjacent Cu6Sn 5 grains grain boundaries. The orientation of Cu3Sn was unrelated to that of Cu or Cu6Sn5, but had preferred orientations of Cu3Sn (100) parallel to the Cu substrate.",

keywords = "Cu single crystal, EBSD, Growth mechanisms, Intermetallic compound joint, Orientation",

author = "Rui Zhang and Yanhong Tian and Baolei Liu and Chunjin Hang",

year = "2013",

doi = "10.1109/ICEPT.2013.6756690",

language = "英语",

pages = "1276--1279",

note = "2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013 ; Conference date: 11-08-2013 Through 14-08-2013",

}

TY - CONF

T1 - Growth mechanism of Cu-Sn full IMC joints on polycrystalline and single crystal Cu substrate

AU - Zhang, Rui

AU - Tian, Yanhong

AU - Liu, Baolei

AU - Hang, Chunjin

PY - 2013

Y1 - 2013

N2 - Growth mechanisms of Cu-Sn IMC joints bonded at 300°C on polycrystalline and single crystal Cu substrates were investigated by Scanning Electron Microscopy (SEM) and Electron Backscatter Diffraction (EBSD) technology. The results showed that the prism-type Cu6Sn5 grains formed on single crystal Cu substrate in the initial stage grew into the scallop-type Cu6Sn5 grains by grain rotation and merge mechanism with the proceeding of the bonding. In addition, the scallop-type Cu6Sn5 grains didn't have preferred orientation. The columnar Cu3Sn grains grew in clusters at the expense of Cu 6Sn5 along direction of the adjacent Cu6Sn 5 grains grain boundaries. The orientation of Cu3Sn was unrelated to that of Cu or Cu6Sn5, but had preferred orientations of Cu3Sn (100) parallel to the Cu substrate.

AB - Growth mechanisms of Cu-Sn IMC joints bonded at 300°C on polycrystalline and single crystal Cu substrates were investigated by Scanning Electron Microscopy (SEM) and Electron Backscatter Diffraction (EBSD) technology. The results showed that the prism-type Cu6Sn5 grains formed on single crystal Cu substrate in the initial stage grew into the scallop-type Cu6Sn5 grains by grain rotation and merge mechanism with the proceeding of the bonding. In addition, the scallop-type Cu6Sn5 grains didn't have preferred orientation. The columnar Cu3Sn grains grew in clusters at the expense of Cu 6Sn5 along direction of the adjacent Cu6Sn 5 grains grain boundaries. The orientation of Cu3Sn was unrelated to that of Cu or Cu6Sn5, but had preferred orientations of Cu3Sn (100) parallel to the Cu substrate.

KW - Cu single crystal

KW - EBSD

KW - Growth mechanisms

KW - Intermetallic compound joint

KW - Orientation

UR - https://www.scopus.com/pages/publications/84898043043

U2 - 10.1109/ICEPT.2013.6756690

DO - 10.1109/ICEPT.2013.6756690

M3 - 论文

AN - SCOPUS:84898043043

SP - 1276

EP - 1279

T2 - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013

Y2 - 11 August 2013 through 14 August 2013

ER -

Growth mechanism of Cu-Sn full IMC joints on polycrystalline and single crystal Cu substrate

Abstract

Conference

Keywords

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