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Growth kinetics analysis of Nb–Al intermetallic compounds interfacial layers based on Nb–Al phase diagram

  • Xianjun Lei
  • , Xiaopeng Wang
  • , Fantao Kong*
  • , Haitao Zhou
  • , Yuyong Chen
  • *Corresponding author for this work
  • Harbin Institute of Technology
  • Harbin Institute of Technology
  • Shanghai Spaceflight Precision Machinery Institute

Research output: Contribution to journalArticlepeer-review

Abstract

A model for studying the growth kinetics of intermetallic compounds by means of binary phase diagrams was proposed with some assumptions. The parabolic growth relationship of intermetallic compound is deduced mathematically using analytical solution of diffusion equations and the mass balance law. By comparing the solubility of the adjacent phase in intermetallic compound phase, the predominant parameter controlling the growth kinetics is the solute diffusion coefficient. The diffusion coefficient of Al atoms in intermetallic layers is quantitatively described and the smallest diffusion coefficient is 0.373 × 10−21 m2/s in Nb3Al phase. It is demonstrated intermetallic layers formed at interface indeed inhibit the Nb container being corroded further by TiAl melt, and Nb3Al layer is a dominant factor.

Original languageEnglish
Article number110589
JournalVacuum
Volume194
DOIs
StatePublished - Dec 2021

Keywords

  • Diffusion coefficient
  • Growth kinetics
  • Intermetallic compound
  • Niobium aluminides
  • Phase diagram

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