Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5grains on Cu substrates

Ming Yang; Yong Ho Ko; Junghwan Bang; Taek Soo Kim; Chang Woo Lee; Shuye Zhang; Mingyu Li

doi:10.1016/j.jallcom.2017.01.109

Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu₆Sn₅grains on Cu substrates

Ming Yang
, Yong Ho Ko
, Junghwan Bang
, Taek Soo Kim
, Chang Woo Lee^*
, Shuye Zhang
, Mingyu Li

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

34 Scopus citations

Abstract

An effective method for inhibiting the growth of interfacial intermetallic compounds during solid-state aging has been proposed in this study. Pre-tinned Cu substrates containing oriented interfacial Cu₆Sn₅grains were prepared and reacted with a low-Ag Pb-free solder. The results show that the initial oriented interfacial grains were retained after the subsequent reflow. In addition, the presence of the oriented grains accelerated their orientation concentration and significantly affected the ultimate orientation distribution range during solid-state aging. As a result, the growth of the interfacial intermetallic compounds was inhibited due to the slower diffusion of Sn species through the solder/substrate interface.

Original language	English
Pages (from-to)	533-541
Number of pages	9
Journal	Journal of Alloys and Compounds
Volume	701
DOIs	https://doi.org/10.1016/j.jallcom.2017.01.109
State	Published - 2017
Externally published	Yes

Keywords

Crystal orientation
Growth kinetics
Interfacial reaction
Lead-free solder
Low Ag content solder

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10.1016/j.jallcom.2017.01.109

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@article{760c221a377a4d9798e179edef0804a8,

title = "Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5grains on Cu substrates",

abstract = "An effective method for inhibiting the growth of interfacial intermetallic compounds during solid-state aging has been proposed in this study. Pre-tinned Cu substrates containing oriented interfacial Cu6Sn5grains were prepared and reacted with a low-Ag Pb-free solder. The results show that the initial oriented interfacial grains were retained after the subsequent reflow. In addition, the presence of the oriented grains accelerated their orientation concentration and significantly affected the ultimate orientation distribution range during solid-state aging. As a result, the growth of the interfacial intermetallic compounds was inhibited due to the slower diffusion of Sn species through the solder/substrate interface.",

keywords = "Crystal orientation, Growth kinetics, Interfacial reaction, Lead-free solder, Low Ag content solder",

author = "Ming Yang and Ko, \{Yong Ho\} and Junghwan Bang and Kim, \{Taek Soo\} and Lee, \{Chang Woo\} and Shuye Zhang and Mingyu Li",

note = "Publisher Copyright: {\textcopyright} 2017 Elsevier B.V.",

year = "2017",

doi = "10.1016/j.jallcom.2017.01.109",

language = "英语",

volume = "701",

pages = "533--541",

journal = "Journal of Alloys and Compounds",

issn = "0925-8388",

publisher = "Elsevier B.V.",

}

TY - JOUR

T1 - Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5grains on Cu substrates

AU - Yang, Ming

AU - Ko, Yong Ho

AU - Bang, Junghwan

AU - Kim, Taek Soo

AU - Lee, Chang Woo

AU - Zhang, Shuye

AU - Li, Mingyu

PY - 2017

Y1 - 2017

N2 - An effective method for inhibiting the growth of interfacial intermetallic compounds during solid-state aging has been proposed in this study. Pre-tinned Cu substrates containing oriented interfacial Cu6Sn5grains were prepared and reacted with a low-Ag Pb-free solder. The results show that the initial oriented interfacial grains were retained after the subsequent reflow. In addition, the presence of the oriented grains accelerated their orientation concentration and significantly affected the ultimate orientation distribution range during solid-state aging. As a result, the growth of the interfacial intermetallic compounds was inhibited due to the slower diffusion of Sn species through the solder/substrate interface.

AB - An effective method for inhibiting the growth of interfacial intermetallic compounds during solid-state aging has been proposed in this study. Pre-tinned Cu substrates containing oriented interfacial Cu6Sn5grains were prepared and reacted with a low-Ag Pb-free solder. The results show that the initial oriented interfacial grains were retained after the subsequent reflow. In addition, the presence of the oriented grains accelerated their orientation concentration and significantly affected the ultimate orientation distribution range during solid-state aging. As a result, the growth of the interfacial intermetallic compounds was inhibited due to the slower diffusion of Sn species through the solder/substrate interface.

KW - Crystal orientation

KW - Growth kinetics

KW - Interfacial reaction

KW - Lead-free solder

KW - Low Ag content solder

UR - https://www.scopus.com/pages/publications/85010450393

U2 - 10.1016/j.jallcom.2017.01.109

DO - 10.1016/j.jallcom.2017.01.109

M3 - 文章

AN - SCOPUS:85010450393

SN - 0925-8388

VL - 701

SP - 533

EP - 541

JO - Journal of Alloys and Compounds

JF - Journal of Alloys and Compounds

ER -

Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu₆Sn₅grains on Cu substrates

Abstract

Keywords

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