Growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface

Ming Yang; Mingyu Li; Ling Wang; Yonggao Fu; Jongmyung Kim; Lvqian Weng

doi:10.1016/j.matlet.2011.02.056

Growth behavior of Cu₆Sn₅ grains formed at an Sn3.5Ag/Cu interface

Ming Yang
, Mingyu Li^*
, Ling Wang
, Yonggao Fu
, Jongmyung Kim
, Lvqian Weng

^*Corresponding author for this work

Harbin Institute of Technology Shenzhen
China National Electric Apparatus Research Institute Co., Ltd.
Jeonnam Provincial College

Research output: Contribution to journal › Article › peer-review

38 Scopus citations

Abstract

The growth behavior of Cu₆Sn₅ grains formed at an Sn3.5Ag/Cu interface was investigated. During soldering, Cu₆Sn ₅ grains formed at the interface, showing a flattened ovoid shape. During solidification, Cu precipitated from molten solder in the form of Cu ₆Sn₅, forming faceted surfaces on existing interfacial grains. The interfacial Cu₆Sn₅ morphology was unrelated to its crystal orientation, which was primarily dependent on reaction temperature. A reaction temperature of 240 °C led to an increase in (002) growth and a decrease in (101) growth with time. However, the (002) plane peak was not detected in the interfacial grains formed at a higher reaction temperature (280 °C).

Original language	English
Pages (from-to)	1506-1509
Number of pages	4
Journal	Materials Letters
Volume	65
Issue number	10
DOIs	https://doi.org/10.1016/j.matlet.2011.02.056
State	Published - 31 May 2011
Externally published	Yes

Keywords

Crystal orientation
CuSn
Lead-free solder
Morphology evolution

Access to Document

10.1016/j.matlet.2011.02.056

Cite this

@article{4a14b2679561485682aa23bed8eabae5,

title = "Growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface",

abstract = "The growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface was investigated. During soldering, Cu6Sn 5 grains formed at the interface, showing a flattened ovoid shape. During solidification, Cu precipitated from molten solder in the form of Cu 6Sn5, forming faceted surfaces on existing interfacial grains. The interfacial Cu6Sn5 morphology was unrelated to its crystal orientation, which was primarily dependent on reaction temperature. A reaction temperature of 240 °C led to an increase in (002) growth and a decrease in (101) growth with time. However, the (002) plane peak was not detected in the interfacial grains formed at a higher reaction temperature (280 °C).",

keywords = "Crystal orientation, CuSn, Lead-free solder, Morphology evolution",

author = "Ming Yang and Mingyu Li and Ling Wang and Yonggao Fu and Jongmyung Kim and Lvqian Weng",

year = "2011",

month = may,

day = "31",

doi = "10.1016/j.matlet.2011.02.056",

language = "英语",

volume = "65",

pages = "1506--1509",

journal = "Materials Letters",

issn = "0167-577X",

publisher = "Elsevier B.V.",

number = "10",

}

TY - JOUR

T1 - Growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface

AU - Yang, Ming

AU - Li, Mingyu

AU - Wang, Ling

AU - Fu, Yonggao

AU - Kim, Jongmyung

AU - Weng, Lvqian

PY - 2011/5/31

Y1 - 2011/5/31

N2 - The growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface was investigated. During soldering, Cu6Sn 5 grains formed at the interface, showing a flattened ovoid shape. During solidification, Cu precipitated from molten solder in the form of Cu 6Sn5, forming faceted surfaces on existing interfacial grains. The interfacial Cu6Sn5 morphology was unrelated to its crystal orientation, which was primarily dependent on reaction temperature. A reaction temperature of 240 °C led to an increase in (002) growth and a decrease in (101) growth with time. However, the (002) plane peak was not detected in the interfacial grains formed at a higher reaction temperature (280 °C).

AB - The growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface was investigated. During soldering, Cu6Sn 5 grains formed at the interface, showing a flattened ovoid shape. During solidification, Cu precipitated from molten solder in the form of Cu 6Sn5, forming faceted surfaces on existing interfacial grains. The interfacial Cu6Sn5 morphology was unrelated to its crystal orientation, which was primarily dependent on reaction temperature. A reaction temperature of 240 °C led to an increase in (002) growth and a decrease in (101) growth with time. However, the (002) plane peak was not detected in the interfacial grains formed at a higher reaction temperature (280 °C).

KW - Crystal orientation

KW - CuSn

KW - Lead-free solder

KW - Morphology evolution

UR - https://www.scopus.com/pages/publications/79953182293

U2 - 10.1016/j.matlet.2011.02.056

DO - 10.1016/j.matlet.2011.02.056

M3 - 文章

AN - SCOPUS:79953182293

SN - 0167-577X

VL - 65

SP - 1506

EP - 1509

JO - Materials Letters

JF - Materials Letters

IS - 10

ER -

Growth behavior of Cu₆Sn₅ grains formed at an Sn3.5Ag/Cu interface

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this