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Grain Refinement in Surficial Cryogenic Grinding

  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

Gradient ultra-fine-grained microstructures of pure copper were obtained via surficial cryogenic grinding. The microhardness increased gradually from 110 to 158 HV, corresponding to the nondeformed matrix and the surficial materials, respectively. Elongated and equiaxed ultrafine grains were observed. The modes of grain refinement in the severe cryogenic plastic deformation were identified: split of the grains and dynamic recrystallization, corresponding to different strain rates, respectively.

Original languageEnglish
Pages (from-to)3349-3353
Number of pages5
JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume51
Issue number7
DOIs
StatePublished - 1 Jul 2020

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