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Grain growth and the Hall-Petch relationship in a high-entropy FeCrNiCoMn alloy

  • W. H. Liu
  • , Y. Wu
  • , J. Y. He
  • , T. G. Nieh
  • , Z. P. Lu*
  • *Corresponding author for this work
  • University of Science and Technology Beijing
  • University of Tennessee

Research output: Contribution to journalArticlepeer-review

Abstract

A high-entropy FeCoNiCrMn alloy with a single face-centered cubic phase was synthesized and subsequently annealed at different temperatures to systematically investigate the grain growth behavior. It was observed that the growth kinetics could be described by a power law of 3 and the activation energy for growth was about 321.7 kJ mol-1. The hardness of the alloys was measured as a function of grain size, and the result was found to follow the classical Hall-Petch strengthening, though with a relatively high hardening coefficient.

Original languageEnglish
Pages (from-to)526-529
Number of pages4
JournalScripta Materialia
Volume68
Issue number7
DOIs
StatePublished - Apr 2013
Externally publishedYes

Keywords

  • Grain boundary migration
  • Grain growth
  • Hall-Petch effect
  • High-entropy alloy

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