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Gold wire stress analysis of wire feed system in automatic wire bonder

  • Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The wire feed system is an important subsystem of typical automatic wire bonder. The resistance control of wire transmission and tensile force control are the key technologies of the wire feed system, which has a strong impact on the bonding quality. This paper describes the stress analysis of gold wire in the automatic wire bonder. The analysis is useful in the low friction wire feed system and the low resistance transmission. Two stress models of gold wire are developed in the air guide and vacuum tensioner. The relationships between the control parameters of air guide and vacuum tensioner and the stress on gold wire are found out. Results of the experiments of this stress analysis procedure are given to illustrate the proposed models. Emphasis is placed on the construction of the mathematical models of air guide and vacuum tensioner by which the stress of gold wire is evaluated.

Original languageEnglish
Title of host publication2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009
Pages364-368
Number of pages5
DOIs
StatePublished - 2009
Event2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009 - Changchun, China
Duration: 9 Aug 200912 Aug 2009

Publication series

Name2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009

Conference

Conference2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009
Country/TerritoryChina
CityChangchun
Period9/08/0912/08/09

Keywords

  • Air guide
  • Vacuum tensioner
  • Wire bonding wire feed system

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