GH5188 高温合金 TLP 接头等温凝固过程数值计算

An important parameter in the TLP welding process is the time required for complete isothermal solidification. In this study, KCo10 intermediate layer was used for the tests, which were carried out at temperatures of 1130, 1150 and 1180 ℃ (1403, 1423 and 1453 K) for different holding time. The average athermally solidified zone (ASZ) size was measured using the solid solution on both sides of the eutectic liquid phase as the boundary. By measuring the size variation of the ASZ with the square root of the welding time, data fitting was used to derive a linear relationship between the ASZ size and the bonding time. And then a mathematical model of the isothermal solidification process was established based on Fick’s Second Law of diffusion equation with time, and the isothermal solidification time t_IS was simulated and solved so as to predict the approximate time required for isothermal solidification. Finally, the accuracy of the mathematical model in predicting the isothermal solidification time was verified experimentally.