Abstract
In order to find a trade-off between the heating duration and temperature overshoot, a fuzzy control strategy is adopted to control the temperature of heating furnace for MEMS device encapsulation process. Instead of complicated and expensive hardware, software compensation for the thermocouple is adopted. A tiny power compensation strategy is proposed to realize high precision temperature control. The experiments and applications using prototype show that the heating process is obviously improved by fuzzy control strategy and the temperature stability is markedly improved by tiny power compensation.
| Original language | English |
|---|---|
| Pages (from-to) | 587-590+603 |
| Journal | Harbin Gongye Daxue Xuebao/Journal of Harbin Institute of Technology |
| Volume | 37 |
| Issue number | 5 |
| State | Published - May 2005 |
Keywords
- Fuzzy control
- Software compensation
- Temperature control
- Tiny power compensation
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