FT-IR spectroscopic and residual stress studies on curing of epoxy resin waterborne

Jinshu Yu; D. Zhou; W. Cai; S. H. Park; T. J. Shin; W. Oh; S. W. Lee; M. Ree

doi:10.1080/10587250108024760

FT-IR spectroscopic and residual stress studies on curing of epoxy resin waterborne

Jinshu Yu
, D. Zhou^*
, W. Cai
, S. H. Park
, T. J. Shin
, W. Oh
, S. W. Lee
, M. Ree

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology
Pohang University of Science and Technology

Research output: Contribution to journal › Article › peer-review

Abstract

For an epoxy resin waterborne system mixed with a curing agent, butanone oxime blocked 4,4′-methylenediphenyldiisocyanate, curing-reaction-induced residual stress generation was in-situ measured in thin films adhered on silicon substrates. This measurement was carried out with varying composition as well as curing temperature, time and step. The residual stress was dependent upon the composition, the deblocking process of the curing agent and the curing condition. In addition, cured films were examined by FT-IR spectroscopy, differential scanning calorimetry, and thermogravimetric analysis.

Original language	English
Pages (from-to)	359-364
Number of pages	6
Journal	Molecular Crystals and Liquid Crystals Science and Technology, Section A: Molecular Crystals and Liquid Crystals
Volume	371
DOIs	https://doi.org/10.1080/10587250108024760
State	Published - 2001

Keywords

Blocked isocyanate
Curing reaction
Deblocking reaction
Epoxy resin waterborne
Network formation
Residual stress

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10.1080/10587250108024760

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title = "FT-IR spectroscopic and residual stress studies on curing of epoxy resin waterborne",

abstract = "For an epoxy resin waterborne system mixed with a curing agent, butanone oxime blocked 4,4′-methylenediphenyldiisocyanate, curing-reaction-induced residual stress generation was in-situ measured in thin films adhered on silicon substrates. This measurement was carried out with varying composition as well as curing temperature, time and step. The residual stress was dependent upon the composition, the deblocking process of the curing agent and the curing condition. In addition, cured films were examined by FT-IR spectroscopy, differential scanning calorimetry, and thermogravimetric analysis.",

keywords = "Blocked isocyanate, Curing reaction, Deblocking reaction, Epoxy resin waterborne, Network formation, Residual stress",

author = "Jinshu Yu and D. Zhou and W. Cai and Park, \{S. H.\} and Shin, \{T. J.\} and W. Oh and Lee, \{S. W.\} and M. Ree",

year = "2001",

doi = "10.1080/10587250108024760",

language = "英语",

volume = "371",

pages = "359--364",

journal = "Molecular Crystals and Liquid Crystals Science and Technology, Section A: Molecular Crystals and Liquid Crystals",

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T1 - FT-IR spectroscopic and residual stress studies on curing of epoxy resin waterborne

AU - Yu, Jinshu

AU - Zhou, D.

AU - Cai, W.

AU - Park, S. H.

AU - Shin, T. J.

AU - Oh, W.

AU - Lee, S. W.

AU - Ree, M.

PY - 2001

Y1 - 2001

N2 - For an epoxy resin waterborne system mixed with a curing agent, butanone oxime blocked 4,4′-methylenediphenyldiisocyanate, curing-reaction-induced residual stress generation was in-situ measured in thin films adhered on silicon substrates. This measurement was carried out with varying composition as well as curing temperature, time and step. The residual stress was dependent upon the composition, the deblocking process of the curing agent and the curing condition. In addition, cured films were examined by FT-IR spectroscopy, differential scanning calorimetry, and thermogravimetric analysis.

AB - For an epoxy resin waterborne system mixed with a curing agent, butanone oxime blocked 4,4′-methylenediphenyldiisocyanate, curing-reaction-induced residual stress generation was in-situ measured in thin films adhered on silicon substrates. This measurement was carried out with varying composition as well as curing temperature, time and step. The residual stress was dependent upon the composition, the deblocking process of the curing agent and the curing condition. In addition, cured films were examined by FT-IR spectroscopy, differential scanning calorimetry, and thermogravimetric analysis.

KW - Blocked isocyanate

KW - Curing reaction

KW - Deblocking reaction

KW - Epoxy resin waterborne

KW - Network formation

KW - Residual stress

UR - https://www.scopus.com/pages/publications/31944433151

U2 - 10.1080/10587250108024760

DO - 10.1080/10587250108024760

M3 - 文章

AN - SCOPUS:31944433151

SN - 1058-725X

VL - 371

SP - 359

EP - 364

JO - Molecular Crystals and Liquid Crystals Science and Technology, Section A: Molecular Crystals and Liquid Crystals

JF - Molecular Crystals and Liquid Crystals Science and Technology, Section A: Molecular Crystals and Liquid Crystals

ER -

FT-IR spectroscopic and residual stress studies on curing of epoxy resin waterborne

Abstract

Keywords

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