Formation and change of AuSn4 compounds at interface between PBGA solder ball and Au/Ni/Cu metallization during laser and infra-red reflow soldering

Y. H. Tian; C. Q. Wang

Formation and change of AuSn₄ compounds at interface between PBGA solder ball and Au/Ni/Cu metallization during laser and infra-red reflow soldering

Y. H. Tian^*
, C. Q. Wang

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) during laser and infrared reflow soldering were studied. During laser reflow soldering process, a thin layer of AuSn₄ was observed at the interface of the solder bumps, its morphology was strongly dependent on the laser reflow power and heating time. The solder bumps formed by the first laser reflow was reflowed again to form the solder joints. The AuSn₄, compounds formed in the first laser reflow process dissolved into the bulk solder after the secondary infrared reflow process. The needle-like AuSn₄ changed into rod-like, and distributed inside the solder near the solder/pad interface.

Original language	English
Pages (from-to)	199-204
Number of pages	6
Journal	Acta Metallurgica Sinica (English Letters)
Volume	17
Issue number	2
State	Published - Apr 2004

Keywords

Bump's micro structure
Infrared reflow
Laser reflow
Solder joint

Cite this

@article{8083f6bcb1a6477a8073389a53e51119,

title = "Formation and change of AuSn4 compounds at interface between PBGA solder ball and Au/Ni/Cu metallization during laser and infra-red reflow soldering",

abstract = "Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) during laser and infrared reflow soldering were studied. During laser reflow soldering process, a thin layer of AuSn4 was observed at the interface of the solder bumps, its morphology was strongly dependent on the laser reflow power and heating time. The solder bumps formed by the first laser reflow was reflowed again to form the solder joints. The AuSn4, compounds formed in the first laser reflow process dissolved into the bulk solder after the secondary infrared reflow process. The needle-like AuSn4 changed into rod-like, and distributed inside the solder near the solder/pad interface.",

keywords = "Bump's micro structure, Infrared reflow, Laser reflow, Solder joint",

author = "Tian, \{Y. H.\} and Wang, \{C. Q.\}",

year = "2004",

month = apr,

language = "英语",

volume = "17",

pages = "199--204",

journal = "Acta Metallurgica Sinica (English Letters)",

issn = "1006-7191",

publisher = "Springer Nature",

number = "2",

}

TY - JOUR

T1 - Formation and change of AuSn4 compounds at interface between PBGA solder ball and Au/Ni/Cu metallization during laser and infra-red reflow soldering

AU - Tian, Y. H.

AU - Wang, C. Q.

PY - 2004/4

Y1 - 2004/4

N2 - Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) during laser and infrared reflow soldering were studied. During laser reflow soldering process, a thin layer of AuSn4 was observed at the interface of the solder bumps, its morphology was strongly dependent on the laser reflow power and heating time. The solder bumps formed by the first laser reflow was reflowed again to form the solder joints. The AuSn4, compounds formed in the first laser reflow process dissolved into the bulk solder after the secondary infrared reflow process. The needle-like AuSn4 changed into rod-like, and distributed inside the solder near the solder/pad interface.

AB - Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) during laser and infrared reflow soldering were studied. During laser reflow soldering process, a thin layer of AuSn4 was observed at the interface of the solder bumps, its morphology was strongly dependent on the laser reflow power and heating time. The solder bumps formed by the first laser reflow was reflowed again to form the solder joints. The AuSn4, compounds formed in the first laser reflow process dissolved into the bulk solder after the secondary infrared reflow process. The needle-like AuSn4 changed into rod-like, and distributed inside the solder near the solder/pad interface.

KW - Bump's micro structure

KW - Infrared reflow

KW - Laser reflow

KW - Solder joint

UR - https://www.scopus.com/pages/publications/3142649370

M3 - 文章

AN - SCOPUS:3142649370

SN - 1006-7191

VL - 17

SP - 199

EP - 204

JO - Acta Metallurgica Sinica (English Letters)

JF - Acta Metallurgica Sinica (English Letters)

IS - 2

ER -

Formation and change of AuSn₄ compounds at interface between PBGA solder ball and Au/Ni/Cu metallization during laser and infra-red reflow soldering

Abstract

Keywords

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