Fluid dynamics around a dimpled Pin-Fin

R. K. Nagar; J. P. Meyer; Md MahbubAlam; G. Spedding

doi:10.1115/imece2011-63427

Fluid dynamics around a dimpled Pin-Fin

R. K. Nagar^*
, J. P. Meyer
, Md MahbubAlam
, G. Spedding

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The most common and popular cooling mechanism found in various industrial applications is pin-fins. These industrial applications include cooling of heat exchangers, as well as the cooling of micro electronic equipment. With the increased heat output of these devices, new enhancement techniques have been investigated. A surface enhancement technique of using offset shallow dimples on pin-fins was found to increase the heat transfer rate by up to 30%. The insight into the mechanism is, however, not known in fluid dynamics. A numerical investigation is conducted to get insight into the mechanism, comparing fluid dynamics around a single smooth cylinder with that around a dimpled cylinder.

Original language	English
Title of host publication	Mechanics of Solids, Structures and Fluids; Vibration, Acoustics and Wave Propagation
Publisher	American Society of Mechanical Engineers (ASME)
Pages	341-350
Number of pages	10
ISBN (Print)	9780791854945
DOIs	https://doi.org/10.1115/imece2011-63427
State	Published - 2011
Externally published	Yes
Event	ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011 - Denver, CO, United States Duration: 11 Nov 2011 → 17 Nov 2011

Publication series

Name	ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011
Volume	8

Conference

Conference	ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011
Country/Territory	United States
City	Denver, CO
Period	11/11/11 → 17/11/11

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10.1115/imece2011-63427

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Nagar, R. K., Meyer, J. P., MahbubAlam, M., & Spedding, G. (2011). Fluid dynamics around a dimpled Pin-Fin. In Mechanics of Solids, Structures and Fluids; Vibration, Acoustics and Wave Propagation (pp. 341-350). (ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011; Vol. 8). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/imece2011-63427

@inproceedings{5bb3ec6271784b279a57980f86d6dfaa,

title = "Fluid dynamics around a dimpled Pin-Fin",

abstract = "The most common and popular cooling mechanism found in various industrial applications is pin-fins. These industrial applications include cooling of heat exchangers, as well as the cooling of micro electronic equipment. With the increased heat output of these devices, new enhancement techniques have been investigated. A surface enhancement technique of using offset shallow dimples on pin-fins was found to increase the heat transfer rate by up to 30\%. The insight into the mechanism is, however, not known in fluid dynamics. A numerical investigation is conducted to get insight into the mechanism, comparing fluid dynamics around a single smooth cylinder with that around a dimpled cylinder.",

author = "Nagar, \{R. K.\} and Meyer, \{J. P.\} and Md MahbubAlam and G. Spedding",

year = "2011",

doi = "10.1115/imece2011-63427",

language = "英语",

isbn = "9780791854945",

series = "ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011",

publisher = "American Society of Mechanical Engineers (ASME)",

pages = "341--350",

booktitle = "Mechanics of Solids, Structures and Fluids; Vibration, Acoustics and Wave Propagation",

address = "美国",

note = "ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011 ; Conference date: 11-11-2011 Through 17-11-2011",

}

Nagar, RK, Meyer, JP, MahbubAlam, M & Spedding, G 2011, Fluid dynamics around a dimpled Pin-Fin. in Mechanics of Solids, Structures and Fluids; Vibration, Acoustics and Wave Propagation. ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011, vol. 8, American Society of Mechanical Engineers (ASME), pp. 341-350, ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011, Denver, CO, United States, 11/11/11. https://doi.org/10.1115/imece2011-63427

Fluid dynamics around a dimpled Pin-Fin. / Nagar, R. K.; Meyer, J. P.; MahbubAlam, Md et al.
Mechanics of Solids, Structures and Fluids; Vibration, Acoustics and Wave Propagation. American Society of Mechanical Engineers (ASME), 2011. p. 341-350 (ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011; Vol. 8).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Fluid dynamics around a dimpled Pin-Fin

AU - Nagar, R. K.

AU - Meyer, J. P.

AU - MahbubAlam, Md

AU - Spedding, G.

PY - 2011

Y1 - 2011

N2 - The most common and popular cooling mechanism found in various industrial applications is pin-fins. These industrial applications include cooling of heat exchangers, as well as the cooling of micro electronic equipment. With the increased heat output of these devices, new enhancement techniques have been investigated. A surface enhancement technique of using offset shallow dimples on pin-fins was found to increase the heat transfer rate by up to 30%. The insight into the mechanism is, however, not known in fluid dynamics. A numerical investigation is conducted to get insight into the mechanism, comparing fluid dynamics around a single smooth cylinder with that around a dimpled cylinder.

AB - The most common and popular cooling mechanism found in various industrial applications is pin-fins. These industrial applications include cooling of heat exchangers, as well as the cooling of micro electronic equipment. With the increased heat output of these devices, new enhancement techniques have been investigated. A surface enhancement technique of using offset shallow dimples on pin-fins was found to increase the heat transfer rate by up to 30%. The insight into the mechanism is, however, not known in fluid dynamics. A numerical investigation is conducted to get insight into the mechanism, comparing fluid dynamics around a single smooth cylinder with that around a dimpled cylinder.

UR - https://www.scopus.com/pages/publications/84869187997

U2 - 10.1115/imece2011-63427

DO - 10.1115/imece2011-63427

M3 - 会议稿件

AN - SCOPUS:84869187997

SN - 9780791854945

T3 - ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011

SP - 341

EP - 350

BT - Mechanics of Solids, Structures and Fluids; Vibration, Acoustics and Wave Propagation

PB - American Society of Mechanical Engineers (ASME)

T2 - ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011

Y2 - 11 November 2011 through 17 November 2011

ER -

Fluid dynamics around a dimpled Pin-Fin

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