Flexible CF/MXene composites with integrated thermal management and electromagnetic interference shielding performance: A 3D filler architecture route via electrostatic self-assembly

Attributed to the miniaturized configuration of electronic products, it is imperative to explore new materials with integrated capabilities for efficient heat dissipation and electromagnetic interference (EMI) shielding. Carbon fibers (CFs) have attracted considerable interest owing to their advantageous combination of low weight, high strength, excellent thermal and electrical conductivities, and chemical resistance. MXene is characterized by a layered structure and notable dielectric properties. In this study, we have utilized the stepwise freeze-drying and electrostatic self-assembled technique to construct a three-dimensional (3D) CF/MXene hybrid skeleton with honeycomb-like topological structure, followed by the vacuum-assisted molding method to fabricate the flexible CF/MXene/PDMS (CMP) composite material. The 3D CF/MXene hybrid skeleton acts as an efficient network for thermal and electrical conduction, which promotes in-plane heat transfer and strengthens the shielding effect by multiple reflections and scattering of electromagnetic waves at inner interfaces. The results demonstrate that the CMP-6 (0.865 g/cm³) achieves an in-plane thermal conductivity of 6.977 W/m·K and an EMI shielding effectiveness of 75.994 dB at a thickness of 2 mm. This research focusing on dual-functional materials compatible with both thermal conduction and EMI shielding holds crucial importance in addressing the constraints of technological development in the era of electronic information.